Medtronic, Inc.

Angela Rodgers

John Daniel Norton

Andrew J Ries

Mark D Breyen

Kurt J Casby

Timothy T Bomstad

Scott J Robinson

Brian Ross

Michael E Clarke

Wayne L Appleseth

Jeffrey L Kehn

Dan D Erklouts

Thomas P Miltich

Joachim Hossick-Schott

Steven Joseph May

Kevin M Gaffney

Karen J Hulting

Brian J Ross

Dan D Erkouts

A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.

Complex connector in component footprint of implantable medical device

At least one storage component, for example a capacitor or a battery, of an implantable medical device includes two perimeter surfaces. Linear extensions of the two perimeter surfaces define a zone. An electrical connector, which is coupled to the storage component and includes at least one connection point for electrically connecting the storage component with at least one other component within the medical device, is contained within the zone defined by the linear extensions of the two perimeter surfaces.

A high voltage capacitor anode for an implantable medical device is fabricated by sintering, anodizing and heat treating a pressed tantalum powder slug. The sintering may be performed at a temperature between approximately 1500&#xb0; C. and approximately 1600&#xb0; C. for a time between approximately 3 minutes and approximately 35 minutes; subsequent anodization may be performed by immersing the slug in an electrolyte at a temperature between approximately 15&#xb0; C. and approximately 30&#xb0; C. and then applying a voltage across the slug, the voltage being between approximately 175 Volts and approximately 375 Volts; subsequent heat treating may be performed at a temperature between approximately 400&#xb0; C. and approximately 460&#xb0; C. for a time between approximately 50 minutes and approximately 65 minutes. Following heat treating, the anode is reformed by a second anodization.

Tantalum anodes for high voltage capacitors employed by implantable medical devices and fabrication thereof

Implantable medical devices (IMDs) and their various components, particularly methods and apparatus for electrically isolating and supporting components of an IMD IPG, e.g., capacitors of a capacitor sub-assembly, thereof in volumetrically efficient ways. A capacitor sub-assembly comprising two or more capacitors stacked side-by-side such that the facing capacitor case major sides are separated by a reliable and simple to apply insulation layer of minimal thickness is disclosed for assembly with other components of an ICD IPG into an IPG housing. A shape conforming insulating spacer is formed of an insulating polymer to conform to the shape of a first capacitor case major side and the perimeter of that major side. The shape conforming insulating spacer is simply applied or adhered by adhesive layers, bands or patterns to one or both of the facing capacitor case major sides.

Electrically insulated component sub-assemblies of implantable medical devices

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Minneapolis, MN, United States of America

Angela Rodgers