Raytech Innovative Solutions, LLC

Raytech Composites, Inc.

Raytech Innovation Solutions, LLC

Angela L Petroski

Paul Fathauer

Richard D Cooper

David Perry

Marc Andrew Yesnik

Richard D Copper

James P Macey

Hualin Jiang

Samuel A Truncone

James Macey

Przemyslaw A Zagrodzki

Jeremiah Joseph Shepard

Friction disc with surface pattern

A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.

Process for molding a friction wafer

A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.

Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same

A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.

Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers

The present invention is related to a method for securing a polishing pad to the platen for use in chemical-mechanical polishing. Specifically, a polishing pad is attached to a platen using a reclosable, hook-and-pile fastener, whereby the platen-attachment fastener may be reused. Separate embodiments are disclosed for attaching porous and nonporous polishing pads.

Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers

A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.

Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making

Polishing pad for use in chemical&#x2014;mechanical planarization of semiconductor wafers and method of making same

Growing community of inventors

Crawfordsville, IN, United States of America

Angela L Petroski