Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Ordos Yuansheng Optoelectronics Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Optotechnology Co., Ltd.

Ang Xiao

Fuyi Cui

Quanqin Sun

Sunghun Song

Wei Li

Liang Zhang

Lina Wang

Haibo Zhu

Shanshan Wang

Xiangnan Wang

Xue Dong

Renwei Guo

Xu Chen

Hongliang Yuan

Bing Li

Kaixuan Wang

Jian Li

Xiaodong Yang

Zifeng Wang

Song Zhang

Jiuxia Yang

Feng Bai

Hao Wu

Xuecheng Hou

Chao Ma

Hongpeng Li

Yangyang Zhang

Zhiyong Liu

Jingjing Chen

Sung Hun Song

Shanshan Bao

Fashun Li

Fujiang Jin

Kai Lu

Xiangdong Qin

Duanming Li

Xiuqiang Zhao

Dan Jia

Xuansheng Wang

Guanyu Lu

Guowei Li

Dengguo Xia

Xueyong Zhang

Hyun Chel Shin

Hongjian Wu

Qijun Liu

Hyunchel Shin

The application provides a sintering apparatus, a packaging system for an organic light emitting diode device and a sintering method, belongs to the technical field of organic light emitting diode device and can solve problems of long process time and high cost existed in the existing high temperature sintering process of organic light emitting diode device. The sintering apparatus comprises two sintering chambers capable of being communicated with each other, during operation, the substrate coated with glass cement is first placed into a sealed first sintering chamber to complete a first sintering process; then the substrate is placed into the second sintering chamber to complete a second sintering process. Thus, a time interval between the first sintering process and the second sintering process can be reduced, and no more nitrogen is wasted in transition from the first sintering process to the second sintering process.

Sintering apparatus, packaging system for organic light emitting diode device and sintering method

An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

Encapsulation method of display panel, display panel, and display device

The present disclosure provides an OLED panel, an OLED packaging method, and a display panel. The OLED panel includes a substrate; an OLED element on a surface of the substrate; an inorganic cover layer on the substrate and the OLED element, the inorganic cover layer being configured to cover a peripheral portion of the surface of the substrate; a bonding layer on the inorganic cover layer; and a barrier layer on the bonding layer, wherein a portion of the bonding layer on the peripheral portion includes at least one rib configured to form an airtight space for isolating the OLED element from the external.

OLED panel having OLED element sealed therein, OLED packaging method for sealing OLED element, and display panel

The present disclosure provides a display assembly, a display device, and a manufacturing process. The display assembly includes: a substrate; a display element arranged in a display region of the substrate; a package film covering the display element; a driving circuit arranged in a non-display region of the substrate; a chip-on-film bonded with the driving circuit; and a support portion arranged in the non-display region of the substrate and outside the package film.

Display assembly, display device and manufacturing process having a support portion in the non-display region of the substrate

A manipulator arm includes at least one arm body for carrying a to-be-carried object. The arm body is provided with a suction plate for sucking the to-be-carried object, and the suction plate is provided with a plurality of vacuum suction holes. The plurality of vacuum suction holes are uniformly distributed in the entire suction plate.

Manipulator arm, manipulator and carrying device

The present disclosure provides an organic light-emitting diode (OLED) device, comprising at least two electron transport layers between a cathode and a light-emitting layer of the device, wherein energy barrier of different electron transport layers successively increase from the cathode to the light-emitting layer. The present disclosure also provides an evaporation equipment and an OLED device manufacturing method, wherein the electron transport layers of the OLED device are formed by an evaporation process using the evaporation equipment. The OLED device of the present disclosure improves the luminescence efficiency of OLED devices, and the evaporation equipment can readily effect a fast switching between different evaporation rates within a same evaporation chamber.

Organic light-emitting diode device, manufacturing method thereof and evaporation equipment

The present disclosure discloses a display panel motherboard, a method of manufacturing a display panel, and a display apparatus. The display panel motherboard includes a first substrate and a second substrate provided opposite to each other. The first substrate has a plurality of first zones and a plurality of second regions, each of the plurality of first zones has a first display region and a first packaging material pattern on a periphery of the first display region, each of the plurality of second zones has a second packaging material pattern, and the second packaging material pattern is at at least one side of the first packaging material pattern facing away from the first display region.

Display panel motherboard, method of manufacturing display panel, and display apparatus

An organic light emission display device and an encapsulation method therefor are provided. The organic light emission display device includes a base substrate, and an organic light emission diode, a barrier layer and an organic thin film encapsulation layer which are disposed on the base substrate. The organic light emission display device further includes a detection layer disposed on the base substrate; and the detection layer is configured to contact with the organic thin film encapsulation layer and make a change in the case that the organic thin film encapsulation layer overflows the barrier layer.

Organic light emission display device and encapsulation method therefor

A sealing method of display panel, comprising: forming closed inner sealant layer in a sealing region of a first substrate; forming outer sealant layer which encloses the inner sealant layer, in which a communicating region is provided, the communicating region is configured to communicate a region between the inner sealant layer and the outer sealant layer and a region outside the outer sealant layer; affixing a second substrate to the first substrate in position to form a motherboard; and sealing the communicating region after cutting out the display panel from the motherboard. A display panel and a display device are also disclosed.

Method of sealing display panel, display panel and display device

An ink jet printhead, an ink-jet printing device and a display manufacturing device are provided for eliminating or reducing droplets on areas outside of the printing area during the ink-jet printing process, thereby improving product quality. The ink jet printhead provided in the disclosure comprises at least one nozzle and a droplet removing component disposed in at least one edge area around the area where the at least one nozzle is located, the droplet removing component being used for eliminating or reducing droplets at positions corresponding to the edge area where the droplet removing component is located.

Ink-jet printhead, ink-jet printing device and display manufacturing device

A packaging structure for an OLED device is provided. The packaging structure includes a plurality of films coated on an outer side of the OLED device and comprising alternately stacked inorganic layers and organic layers, wherein both a film in contact with the OLED device and a film farthest from the OLED device are inorganic layers, wherein the inorganic layer in contact with the OLED device comprises at least two sub-films sequentially stacked, and wherein a contact angle between i) a material for forming a sub-film of the at least two sub-films that contacts an organic layer and ii) an organic material for forming the organic layer is smaller than a preset angle.

Packaging structure for OLED device and display apparatus

The present disclosure provides a laser sintering apparatus and a laser sintering method. The laser sintering apparatus includes a first laser head configured to output a laser beam at a first power level, a second laser head configured to output a laser beam at a second power level, and a driving device configured to drive the first laser head and the second laser head to move, so as to enable the first laser head and the second laser head to heat an identical region of a to-be-sintered material.

Laser sintering apparatus and laser sintering method

The laser sintering device includes a laser sintering head configured to output a laser beam toward a material to be sintered on a device to be sintered, so as to sinter the material to be sintered, and a heating unit configured to, prior to and/or subsequent to sintering the material with the laser sintering head, heating the material to be sintered and/or the sintered material. The material to be sintered is preheated by the heating unit prior to sintering the material to be sintered, and/or the sintered material is annealed by the heating unit subsequent to sintering the material to be sintered, so as to reduce a difference between a temperature before the sintering and a temperature during the sintering, and/or reduce a cooling rate after the sintering, thereby to reduce a shrinkage stress applied to the material to be sintered and the device to be sintered.

Laser sintering device and laser sintering method

The present disclosure relates to a method for packaging an OLED display panel, an OLED display panel and an OLED display device. The method for packaging an OLED display panel comprises: providing a substrate and a cover plate, and forming a covering layer on the substrate, wherein the covering layer has a concave structure. The method further comprises forming another covering layer having a convex structure or forming an adhesive on the cover plate, wherein a bump of the convex structure or the adhesive may be accommodated in a recess of the concave structure.

OLED display panel and method for packaging an OLED display panel with a covering layer having a concave structure

Disclosed are a sealant composition and a method of preparing the same wherein the sealant composition comprises: 70-80 wt % of a low-viscosity epoxy acrylate conforming to the structure of Formula I, 0.5-1 wt % of a photoinitiator, 5-15 wt % of silica microspheres, 5-15 wt % of resinous elastic microspheres, and 1-2 wt % of silane coupling agent, based on the total weight of the sealant composition wherein Rand Rare as defined herein. The sealant has improved coating linearity. 

Sealant composition and method of preparing the same

Growing community of inventors

Beijing, China

Ang Xiao