Adeia Semiconductor Bonding Technologies Inc.

Andy Stavros

David A Gibson

Stuart E Wilson

Ming Tsai

James Gill Shook

Ronald Patrick Green

Sridhar Krishnan

A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.

Stacked microelectronic assemblies

Stacked packages and microelectronic assemblies incorporating the same

An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

Assembly including vertical and horizontal joined circuit panels

A microelectronic assembly incorporates units stacked one above the other and may include a plurality of similar stacks mounted to a circuit board. Some of the stacks may be inverted, rotated or both relative to other stacks so that corresponding edges of the stacks face one another to facilitate communication between the stacks. Communication between the stacks may be carried along traces on one or more interposers intercepting the stacks remote from the circuit board. Within each stack, conducting paths may extend in vertical columns or in other arrangements such as a stair step arrangement wherein each conductive path traverses a series of column positions, or in a crossing arrangement such two conductive paths cross back and forth between column positions along the vertical extend of the stack. A stack may include portions disposed above and below the circuit board.

Stacked packages and systems incorporating the same

A phased antenna array is disclosed. The phased antenna array is composed of one or more modules and has a plurality of antenna. The array has a plurality of antenna configured to operate as an array and each module has at least one antenna. The modules have a substrate that supports the antenna, a microelectronic device for sending signals to or receiving signals from said antenna and conductive traces that connect that antenna to the microelectronic device. In those embodiments where the phased antenna array has more than one module, a common substrate supports the one or more modules. A combination of circuitry and interconnects achieves the desired electrical interconnection between the modules.

Growing community of inventors

San Jose, CA, United States of America

Andy Stavros