Stmicroelectronics (research & Development) Limited

Stmicroelectronics Gmbh

Andy Price

James Peter Drummond Downing

Wing Shenq Wong

Kevin Channon

Eric Christison

Jeffrey M Raynor

Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.

Wafer level microstructures for an optical lens

A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

Molded range and proximity sensor with optical resin lens

An optical module for use in a device includes an array of pixels configured to capture image data and a memory. The memory is configured to store identification information associated with said optical module. The identification information enables retrieval of information for controlling said optical module from a source outside said device.

Optical module and method

An imaging circuit includes at least one photosensitive device that provides an output in response to at least one photon and a compensation circuit configured to provide dark current compensation for the output of said photosensitive device. The applied compensation uses temperature information and temperature dependent calibration information.

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Bonnyrigg, United Kingdom

Andy Price