Massachusetts Institute of Technology

Boston University

Andy Fan

Rafael Reif

Kuan-Neng Chen

Chuan Seng Tan

Catherine Klapperich

George Woodman Pratt, Iv

Disclosed herein are antibodies capable of specifically binding to tenofovir (TFV), a key small molecule drug for both the treatment and prevention of HIV, and a competitive lateral flow assay that uses these antibodies to monitor urine samples for the presence of the drug. The assay can be deployed as a point-of-care device for adherence monitoring.

Tenofovir detection assay

A method of forming a multi-layer semiconductor structure includes attaching a handle-member to a top surface of a first structure using a first interface. At least one region of a bottom surface of the first structure is etched to form at least a first via-hole for exposing a portion of a first conductive member defined on the first structure. A conductive material is disposed in the first via-hole such that a first end of the conductive material is in electrical communication with the first conductive member and a second end of the conductive material is exposed at the bottom surface of the first structure. A second interface is disposed over at least the second end of the conductive material, which serves as a bonding and/or electrical interface between the first conductive member defined on the first structure and a second structure of the multi-layer semiconductor device structure.

Method of forming a multi-layer semiconductor structure incorporating a processing handle member

A method of forming a multi-layer semiconductor structure includes providing a first layer of a patterned copper bond film having a first predetermined thickness onto a first surface of a first semiconductor. The method further includes providing a second layer of a patterned copper bond film having a second predetermined thickness onto a first surface of a second semiconductor. The first and second semiconductor structures can be aligned, such that the first and second patterned copper bond films are disposed in proximity. A virtually seamless bond can be formed between the first and second patterned copper bond films to provide the first and second semiconductors as the multi-layer semiconductor structure.

Growing community of inventors

Cambridge, MA, United States of America

Andy Fan