Rohm & Haas Electronic Materials LLC

Shipley Company LLC

André Egli

Jochen Heber

Michael P Toben

Wan Zhang-Beglinger

Raymund W M Kwok

Craig Robinson

Jonas Guebey

Keith J Whitlaw

Jeffrey N Crosby

Wing Kwong Wong

Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

Anti-displacement hard gold compositions

A method of reducing tin whisker formation including steps of a) providing a tin or tin-alloy bath containing one or more sources of tin and one or more crystal plane orientation enhancing compounds selected from imides, imines, amides, polyamides, amines, polyamines, polyols, dibutyl thiourea, allyl thiourea, amino thiazole, rhodanine, sulfosalicylic acid and sulfamides; and b) electrodepositing a layer of tin or tin-alloy on a substrate, the tin or tin-alloy layer is free of crystal planes or equivalent planes thereof forming an angle of 5&#xb0; to 22&#xb0; with an adjacent crystal plane or an equivalent plane.

Tin plating method

Tin and tin alloy deposits which are substantially free of certain crystal planes or equivalents thereof inhibit or prevent whisker formation. The tin or tin alloy deposits which are free of these crystal planes and inhibit or prevent whisker formation may be deposited by electroplating. Tin alloys include tin/copper, tin/nickel, tin/silver, tin/bismuth, tin/zinc and tin/antimony. The tin and tin alloy baths used to deposit the tin and tin alloys may be acidic or alkaline.

Whisker free tin plated layer

A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Gold alloy electrolytes

A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate.

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Richterswil, Switzerland

André Egli