Telefonaktiebolaget Lm Ericsson (publ)

Microlab/fxr

Andrzej Sawicki

Marek Edward Antkowiak

Joakim Plahn

Martin Schöön

Jurek Dabrowski

It is presented a power amplifier assembly comprising; a radio frequency multi-order power amplifier comprising a circuit board; a grounding structure connected to the radio frequency multi-order power amplifier and comprising a recess; a combining network connected to a plurality of outputs of the radio frequency multi-order power amplifier. The combining network comprises: a plurality of input connection points, wherein each of the plurality of input connection points is connected to a respective output of the plurality of outputs of the radio frequency multi-order power amplifier; an output connection point; and a conductor arrangement comprising a plurality of conductive paths arranged between the plurality of input connection points and the output connection point; wherein at least one of the plurality of conductive paths is at least partly formed by a suspended conductor positioned in the recess of the grounding structure.

Power amplifier assembly comprising suspended strip lines

The invention relates to a directional coupler comprising coupled lines, and a method for achieving coupling in a directional coupler under compensation conditions. The directional coupler comprises coupled lines (), including a first line () and a second line (), and at least one ground plane (). At least one of the ground planes is a tuning ground plane (), and a distance (), between the first() and the second () line, and each distance (), between the first line () and the respective tuning ground plane (), are adapted so as to contribute to a desired coupling level under compensation conditions.

Directional coupler

A multilayer coupled-lines directional coupler of the quarter wavelength type comprises a first, a second and a third conductive layer, joined by means of dielectric layers. The first conductive layer comprises a first and a second conductive strip, separated, mutually parallel, each in one end connected to a first output and in another end connected to a second output. The second conductive layer comprises a third conductive strip, parallel to the first and the second conductive strip, in one end connected to a third output and in another end connected to a fourth output. The first conductive layer comprises a fourth conductive strip, parallel to and located between the first and the second conductive strip, in one end connected to the third output, and in another end connected to the fourth output.

A high power, TEM mode directional microwave coupler having low loss and expanded bandwidth uses novel thick suspended substrate conductors to provide multi-octave bandwidth performance in a practical package. Each of two center conductors is formed using metal layer deposited onto three surfaces of a thick dielectric substrate. The conductors, which can be edge-coupled or offset-coupled, form a novel structure in which the non-metallized side of the substrate is oriented toward the facing outside vertical walls. This effectively reduces the effect of the package wall on the coupling structure, permitting a smaller, constant-width dimension, which in turn raises the waveguide cut-off frequency. The result is a directional coupler with an extended high frequency performance, with reduced physical size and low loss.

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Märsta, Sweden

Andrzej Sawicki