Microsoft Technology Licensing, LLC

Meta Platforms, Inc.

Andriy Pletenetskyy

Roy Joseph Riccomini

Carl J Ledbetter

Joel Bernard Jacobs

Nicolas A Denhez

Young Duk Song

YeongKyu Yoo

Paul A Bosveld

Jason Paul Williams

Lynda Horton-Jones

Yuenkeen Cheong

Michael Bohan

Errol Mark Tazbaz

Philip A Frank

Michael Nikkhoo

Geng Ye

Jennifer Ellen Davis-Wilson

Igor Markovsky

Erin Elizabeth Hurbi

Bruno Cendon Martin

Ce Zhang

Peter Eli Renner

Bernard Schultz

Brandon Potens

Philip Andrew Frank

Apparatuses, methods, and systems for a modular eyewear antenna assembly, are disclosed. One modular eyewear antenna assembly includes an eyewear housing including a front frame and a pair of eyewear temple arms, wherein a physical size and shape of each of the temple arms is selectable from a plurality eyewear assembly SKU sizes and shapes, a printed circuit board (PCB) including a controller and a radio, wherein the PCB extends along at least one of the temple arms, wherein the PCB has a fixed size that is adapted for placement within one of the temple arms, and a modular antenna structure including a planar antenna, wherein the modular antenna structure interfaces with the PCB for providing a wireless propagation path for the radio, wherein the modular antenna structure has a fixed size that is adapted for placement along with the PCB within one of the temple arms.

Modular eyewear antenna assembly

Headset with visor

An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.

Head mounted computing device, adhesive joint system and method

Disclosed is a low-profile microdisplay module that comprises a package substrate, a microdisplay chip disposed over a first surface of the package substrate, and a plurality of conductive vias. The plurality of conductive vias are electrically coupled to the microdisplay chip and disposed through the package substrate to a second surface of the package substrate, the second surface being opposite and parallel to the first surface. The microdisplay module further comprises a flexible flat circuit connector coupled to the plurality of conductive vias at the second surface of the package substrate.

Low-profile microdisplay module

A head-mounted display device includes a head fitting by which the display device can be worn on the head of a user, and a visor assembly mounted to the head fitting. The visor assembly includes a plurality of display elements arranged to be aligned with the eyes of the user, a plurality of sensors, and a protective enclosure that encloses the display elements and the sensors. The protective enclosure may include an upper portion aligned with the sensors and a lower portion aligned with the display elements. The upper portion may be substantially opaque to visible light and transparent to infrared light. The lower portion may have a variable tinting scheme in which at least some of the lower portion of the enclosure is transparent to visible light.

Head-mounted display device with protective visor

A head-mounted display (HMD) device designed for quick and easy mounting and dismounting to and from, respectively, a mounting fixture comprises a display assembly and a chassis coupled to the display assembly. The display assembly includes optical elements configured to convey light to the eyes of a human user when the head-mounted display device is worn by the user. In certain embodiments introduced here, the chassis has an external surface and a fixture interface surface defined within, but not coplanar with, the external surface. The fixture interface surface is configured to mate with a device interface surface of the mounting fixture when the head-mounted display device is mounted to the mounting fixture.

Mounting apparatus for head-mounted display device

A head-mounted display (HMD) device has a chassis, a display assembly, and various sensors and electronics, where the display assembly, sensors and electronics are mounted to the chassis and enclosed within a sealed protective visor, and where the display assembly is mounted to the chassis only through a central location that is aligned with a center-point between the user's eyes, thereby decoupling the display assembly from most mechanical and thermal stresses.

Head-mounted display device with stress-resistant components

Disclosed is a waveguide assembly for a head-mounted display device. The waveguide assembly can comprise a waveguide carrier, a first left waveguide, and a first right waveguide. The waveguide carrier can include a nose bridge portion, and flat left and right mounting surfaces extending from the nose bridge portion, to align with a left eye and a right eye, respectively, of a user of the head-mounted display device. The first left waveguide can be affixed to the left mounting surface of the waveguide carrier only by a first layer of adhesive disposed only around a periphery of a surface of the first left waveguide, while the first right waveguide can be affixed to the right mounting surface of the waveguide carrier only by a second layer of the adhesive disposed only around a periphery of a surface of the first right waveguide.

Low-stress waveguide mounting for head-mounted display device

Growing community of inventors

Mountain View, CA, United States of America

Andriy Pletenetskyy