Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Visteon Global Tech., Inc

International Business Machines Corporation

Other

Ford Global Technolgoies, LLC

Lockheed Martin Corporation

Varroc Lighting Systems, S.r.o

Loral Federal Systems Company

Varroc Engineering Private Limited

Varroccorp Holding Bv

Andrew Zachary Glovatsky

Myron Lemecha

Jay DeAvis Baker

Michael George Todd

Robert Edward Belke

Lakhi Nandlal Goenka

Richard Keith McMillan

Peter Joseph Sinkunas

Vivek Amir Jairazbhoy

Thomas Bernd Krautheim

Lawrence LeRoy Kneisel

Delin Li

Mark David Miller

Brenda Joyce Nation

Mohan R Paruchuri

Robert Joseph Gordon

Vladimir Stoica

Daniel Roger Vander Sluis

Achyuta Achari

Joseph M Giachino

Daniel Phillip Dailey

Robert Edward Belke, Jr

Bernard A Meyer

Patrick M Scott

Michael A Mele

John Trublowski

Cuong Van Pham

Marc Alan Straub

Ram S Raghava

Prathap Amervai Reddy

Jeff C Lin

Rexanne M Coyner

Jeffrey Allen Erion

Edwin Mitchell Sayers

Zhong-You Joe Shi

Paul Zoratti

Robert James Lynch

Harvinder Singh

Charles Frederick Schweitzer

Jeff J Lin

Viren B Merchant

Christopher W Gattis

Michael Allen Howey

Alice Dawn Zitzmann

Pawel Kalinowski

Victor V Zaderej

David James Steinert

Jeff J Klas

Jin Zhou

Xu Song

Yutaka Kawase

Anne Marie Sullivan

Jim Zehnal

James G Motto, Jr

Steve A Repchak

Jimmy Attard

Jean M Vittone

Lawrence R Yetter

Timothy Joseph Yerdon

Medhat Said

Walter Benedette

Alice D Zitzmann

Prasanna Ramsagar

A lighting system for an appliance is disclosed. In one embodiment, the lighting system includes a light shelf including a substantially planar light guide having a support member for releaseably coupling the light shelf to the appliance, a light injector coupled to a first end the light shelf, the light injector including a substrate having at least one light source disposed thereon and a housing for at least partially enclosing the at least one light source, wherein light emitted from the at least one light source is directed into the light guide, and an end piece coupled to a second end of the light shelf opposite the first end.

Lighting system for appliance

Disclosed is an LED package holder for retaining and electrically connecting an LED package. The LED package holder includes a housing configured to hold an LED package and has at least one center opening defined therein. A connector shroud is integrally formed with the housing and has a cavity for receiving a connector operable to supply power to the LED package. Two contact features are retained by the housing, and each contact feature has an inner contact and an outer contact. Each inner contact engages an LED electric terminal of the LED package. Each outer contact extends into the connector shroud so as to engage connector terminals when a connector is inserted into the connector shroud.

LED interconnection integrated connector holder package

An LED interconnect spring clip assembly includes a housing having a center cavity and a plurality of contact features. Each contact feature has a portion retained by the housing and another portion that is operable to contact a terminal of an LED package disposed within the center cavity of the housing. The LED interconnect spring clip assembly retains the LED package when mounted to a substrate.

LED interconnect spring clip assembly

A headlamp assembly for a motor vehicle having a light source, a chamber that receives the light source and a cooling channel for removing heat from the chamber. A conductive wall and an insulating wall cooperate to define the chamber and the channel. The conductive wall has a substantially higher thermal conductivity than the insulating wall to promote the heat exchange between the chamber and the cooling channel and to reduce heat exchange between the cooling channel and the relatively hot engine compartment.

Headlamp assembly with integrated housing and heat sink

The electronic system generally includes an electronic panel having circuitry plated on a surface thereof as well as electronic components attached thereto. The circuitry connects the electronic components for operation of the electronic device in the engine compartment. A flatwire bus electronically connects the electronic panel and the electronic device in the engine compartment for transmitting signals there between. The electronic panel is directly connected to the bulkhead.

Bulkhead flatwire integration units

A headlamp assembly for a motor vehicle including a lens and a housing that cooperate to define an inner chamber that is generally isolated from the atmosphere. A heat sink includes a fin portion that extends from the inner chamber so as to be exposed to ambient air. A light source is located within the inner chamber and is supported on a base portion of the heat sink. The heat sink conducts heat from the light source to air located exterior of the chamber.

Convectively cooled headlamp assembly

An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a housing, the ribs engage the inner wall of the housing to securely position the assembly. Also, the ribs space the microelectronic modules apart from the housing to facilitate coolant gas flow through the housing and thereby improve thermal dissipation during operation.

Assembly comprising multiple microelectronic modules

A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipati9on of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.

Microelectronic package within cylindrical housing

The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle structure is operatively connected to the bottom portion of the substrate. The package substrate has a plurality of layers, where the package substrate is operatively connected to the top portion of the substrate. The package substrate conforms to a periphery area of the top portion of the substrate.

Apparatus and method for protecting an electronic circuit

An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

Electronically integrated vehicle structure

An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site to an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the passenger site of the bulkhead for thermal cooling as well as protection from the harsh environment of the engine compartment. The bulkhead has an aperture sized to allow the flatwire bus to pass through the bulkhead into the engine compartment. By utilizing a flatwire bus, this aperture is small in size and the integrity of the bulkhead is improved.

Underhood electronic interior integration

The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue. The elastically deformable member is made of a metal material allowing it to easily conduct the heat energy.

Liquid cooled metal thermal stack for high-power dies

An automobile instrument panel assembly may be used in the cockpit of an automobile. The assembly includes a cross-car structure having a plurality of recesses and protrusions along the length of the structure and a plurality of generally planar surfaces. A plurality of HVAC components are adapted to closely fit within one or more of the plurality of recesses within the structure, and at least one flatwire bus is affixed to the generally planar surfaces of the structure.

Instrument panel with integrated HVAC and electronic systems

The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.

Vented circuit board for cooling power components

An integrated manifold assembly () for routing electrical signals in an internal combustion engine is disclosed. The assembly includes an air-intake manifold () for drawing fresh air into the internal combustion engine, a main circuit portion () fixable to the air-intake manifold () of the internal combustion engine, a plurality of circuit runner portions () extending from the main circuit portion () for interconnecting the main circuit portion () with a plurality of engine components (), and a heat sink () affixed to the air-intake manifold () and in contact with at least one of the a main circuit portion () and the plurality of circuit runner portions () for dissipating heat generated in the circuit portions.

Integrated powertrain control system for large engines

Growing community of inventors

Plymouth, MI, United States of America

Andrew Zachary Glovatsky