Microsoft Technology Licensing, LLC

Andrew William Hill

Robyn Rebecca Reed McLaughlin

Joseph Benjamin Gault

Jan Raken

Jeffrey Taylor Stellman

Avi R Geiger

John S Campbell

Kurt Jenkins

James Michael Bonicatto

Eugene Lee

Thomas Joseph Longo

Kenneth Charles Boman

Bernard K Rihn

James H Wise

Stephen C Klein

Taylor Stellman

Edward Francis Burress

Avi Hecht

David Zucker

Peter Kyriacou

Robert J Bergeson

Jaya Narain

Steven Nabil Bathiche

Ralf Groene

Rajesh M Dighde

Panos Costa Panay

Ivan Andrew McCracken

David Michael Lane

Andrew Douglas Delano

Duane Martin Evans

Scott Douglas Bowers

Lincoln Matthew Ghioni

Eric Davis

Bo Dan

Robert James Bingham, Jr

Aseem Singla

Nathan Michael Thome

David John Huston

Han Li

Vineet Thuvara

Paul Bornemann

Robert Ullman Myers

James Hao-An Chen Lin

Steve Klein

Shane Sykes

Jeffrey James Heinz

John David Schultz

Dave Huston

Robyn Rebecca Mclaughlin

Thomas J Longo

Nathan Thome

Thomas Longo

In accordance with one implementation, a method for multiple source light output smoothing includes measuring a light distribution generated by multiple light sources arranged within an electronic device and determining at least one brightness adjustment based on the measured light distribution that is sufficient to locally reduce light output within a discrete region of a surface of the electronic device to satisfy predefined luminosity criteria. The method further includes applying an optical filter between the multiple light sources and the surface, the optical filter configured to reduce light output within the discrete region according to the determined at least one brightness adjustment.

Multiple light source output smoothing

Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.

Adaptive airflow guides in an electronic device

A computing device includes a housing having an inner surface, a first outer surface, a second outer surface, and a side extending between the first outer surface and the second outer surface. The computing device also includes a heat generating electronic device, a first heat spreader, and a second heat spreader. At least a portion of the first heat spreader abuts or is adjacent to the inner surface of the housing. The second heat spreader extends from a first position within the housing, at or adjacent to the heat generating electronic device to a second position within the housing. The second position is closer to the side of the housing than the first position. A first portion of the second heat spreader abuts the first heat spreader, and a second portion of the second heat spreader is at a distance from the first heat spreader.

Apparatuses, systems, and methods for improved heat dissipation

Display module support techniques are described. In one or more implementations, an apparatus includes an external enclosure forming a cavity and a touch display module. The touch display module includes a touch panel assembly having one or more touch sensors and a display module to output a display through at least a portion of the touch panel assembly. The apparatus also includes a support that secures the touch display module to the external enclosure. The support is secured to the external enclosure using a reworkable connection.

Display module support

Input device attachment techniques are described. In one or more implementations, a device includes a portion (e.g., an input portion or cover) is configured to be positioned over a display device of a computing device to cover the display device. The device also includes a spine (e.g., a mid-spine) that is physically attached to the portion in a manner that supports rotational movement of the portion in relation to the display device. The physical attachment of the spine is configured to be removable using a magnetic coupling between the spine and a surface of the computing device that includes the display device.

Input device attachment

Enclosure thermal short

The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.

Device sandwich structured composite housing

3D printed thermal management devices and corresponding methods of manufacturing are described herein. A thermal management device includes a single contiguous component including at least a portion of a first heat exchanger and at least a portion of a second heat exchanger. The second heat exchanger is of a different type than the first heat exchanger.

3D printed thermal management system

This document describes a lockable display and techniques enabling use of a lockable display. The techniques can enable computing devices to lock and unlock a display using little or no power and with a seamless design. The techniques and apparatuses can also enable integration between a lockable display and various computing devices, including to create a nearly seamless physical and functional design.

Lockable display and techniques enabling use of lockable displays

Heat dissipation configurations and methods are described herein. A heat dissipation apparatus may include an individual piece of metal having a thermally conductive metal surface. The metal surface includes a plurality of ridges or protrusions extending from a base of the metal surface, wherein an air flow channel is provided between each two adjacent protrusions, therein providing a plurality of air flow channels. The apparatus is configured to dissipate heat for an electronic device having an active cooling source directing air through the plurality of air flow channels. In some examples, the heat dissipation apparatus is a vapor chamber, and the surface includes a section having a trough and a raised area or platform surrounded by the trough, wherein the raised area is configured to contact a microprocessor die in communication with the vapor chamber.

Heat dissipation in electronics

The described technology includes a connecting apparatus for a computing device including a connector protrusion attached to an input component and a receptor formed in a receiving component of the computing device and configured to attach to the connector protrusion. The connector protrusion includes a center section having a plurality of electrical connectors configured within a plastic overmold and configured to be communicatively coupled to the computing device to communicate the generated signals and two end sections having mechanical support components configured to be physically coupled to the computing device wherein each of the two end sections are contiguous to the center section. The receptor includes a locking mechanism configured to releasably attach to the connector protrusion.

Electro-mechanical locking mechanism

In embodiments of electronic compensated pivot control, a computing device includes a device housing that is integrated with a display device, and the device housing tilts for multiple display positions. Pivotable components pivot in coordination to position the display device in a display position, and sensors detect positioning inputs that are received to re-position the display device. Actuators are implemented for electronic actuation to drive the pivotable components to position the display device, and clutches are implemented to limit movement of the pivotable components. A pivot controller is implemented to receive input data corresponding to a user input to change a position of the display device, control the actuators based on the input data to assist with positioning the display device, receive an indication that the user input has stopped, and control the one or more clutches to hold the position of the display device.

Electronic compensated pivot control

Heat dissipation configurations and methods are described herein. Certain electronic devices may include an individual piece of thermally conductive material having a first surface and a second surface. A first section of the thermally conductive material may be positioned between a motherboard and a backing layer of an electronic device such that the first surface of the first section is adjacent to the motherboard and the second surface of the first section is adjacent to the backing layer. A second section of the thermally conductive material may be positioned between a display module and a battery of the electronic device such that the first surface of the second section is adjacent to a back plate of the display module and the second surface of the second section is adjacent to the battery. The thermally conductive material may be configured to transfer heat between the first section and the second section.

Heat dissipation in electronics with a heat spreader

Disclosed herein are computing devices, and methods of manufacturing computing devices, that have a cooling fan and integrated thermal transfer unit. A centrifugal fan unit includes a rotatable hub, a plurality of blades disposed on the rotatable hub, and a motor coupled to the rotatable hub. The motor causes the rotatable hub to rotate about an axis such that airflow proceeds outward from the centrifugal fan unit along trajectories that are perpendicular to the axis. One or more thermal transfer units have first portions that are coupled to the one or more heat sources and second portions that collectively at least partially surround the centrifugal fan unit.

Centrifugal fan with integrated thermal transfer unit

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Redmond, WA, United States of America

Andrew William Hill