Intel Corporation

Applied Materials, Inc.

Andrew W Yeoh

Christopher P Auth

Michael L Hattendorf

Mark T Bohr

Christopher M Pelto

Joseph M Steigerwald

Hiten Kothari

Jinhong Shin

Tahir Ghani

Kevin J Lee

Kevin Fischer

Vinay B Chikarmane

Atul Madhavan

Angelo Kandas

Seshu V Sattiraju

Ilsup Jin

Hang-Shing Ma

Nitin K Ingle

Debendra Mallik

Suketu Arun Parikh

Ram S Viswanath

Sairam Agraharam

Ruth Amy Brain

Barbara A Chappell

Sriram Srinivasan

Ranjith Kumar

M Clair Webb

Sourav Chakravarty

Quan Shi

Charles Henry Wallace

Arvind Sundarrajan

Gregory F Taylor

Guan Huei See

Joung Joo Lee

Mohamed A Abdelmoneum

Tawfik M Rahal-Arabi

Zhanping Chen

Sameer Deshpande

Uddalak Bhattacharya

Ashish Pal

Yen-Chu Yang

Seongtae Jeong

Martinus Maria Berkens

Jiho Kang

El Mehdi Bazizi

Balasubramanian Pranatharthiharan

Tom S Choi

Carole C Montarou

Vinay Chikarmane

Kevin J Fischer

A method of forming a semiconductor device is provided. The method includes forming a superlattice structure on a substrate and etching source and drain trenches adjacent to the superlattice structure. The source and drain trenches are expanded to form cavities, which are filled with a sacrificial material. A source region and a drain region are formed in the trenches. Contacts to the transistor and gate are formed. Backside processing is then performed by flipping the substrate, depositing an interlayer dielectric on the bottom surface, and etching a backside power rail via that is expanded into a damascene trench. The sacrificial material is removed to create openings extending to the damascene trench, and a metal fill is deposited in the openings and trench.

Self-aligned wide backside power rail contacts to multiple transistor sources

Methods open etch stop layers in an integrated environment along with metallization processes. In some embodiments, a method for opening an etch stop layer (ESL) prior to metallization may include etching the ESL with an anisotropic process using direct plasma to form helium ions that are configured to roughen the ESL for a first duration of approximately 10 seconds to approximately 30 seconds, forming aluminum fluoride on the ESL using remote plasma and nitrogen trifluoride gas for a second duration of approximately 10 seconds to approximately 30 seconds, and exposing the ESL to a gas mixture of boron trichloride, trimethylaluminum, and/or dimethylaluminum chloride at a temperature of approximately 100 degrees Celsius to approximately 350 degrees Celsius to remove aluminum fluoride from the ESL and a portion of a material of the ESL for a third duration of approximately 30 seconds to approximately 60 seconds.

Methods for removing etch stop layers

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. An isolation structure surrounds a lower fin portion, the isolation structure comprising an insulating material having a top surface, and a semiconductor material on a portion of the top surface of the insulating material, wherein the semiconductor material is separated from the fin. A gate dielectric layer is over the top of an upper fin portion and laterally adjacent the sidewalls of the upper fin portion, the gate dielectric layer further on the semiconductor material on the portion of the top surface of the insulating material. A gate electrode is over the gate dielectric layer.

Plugs for interconnect lines for advanced integrated circuit structure fabrication

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes first and second gate dielectric layers over a fin. First and second gate electrodes are over the first and second gate dielectric layers, respectively, the first and second gate electrodes both having an insulating cap having a top surface. First dielectric spacer are adjacent the first side of the first gate electrode. A trench contact structure is over a semiconductor source or drain region adjacent first and second dielectric spacers, the trench contact structure comprising an insulating cap on a conductive structure, the insulating cap of the trench contact structure having a top surface substantially co-planar with the insulating caps of the first and second gate electrodes.

Contact over active gate structures for advanced integrated circuit structure fabrication

Multi version library cell handling and integrated circuit structures fabricated therefrom are described. In an example, an integrated circuit structure includes a plurality of gate lines parallel along a first direction of a substrate and having a pitch along a second direction orthogonal to the first direction. A first version of a cell type is over a first portion of the plurality of gate lines, the first version of the cell type including a first plurality of interconnect lines having a second pitch along the second direction, the second pitch less than the first pitch.

Multi version library cell handling and integrated circuit structures fabricated therefrom

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of conductive interconnect lines in and spaced apart by a first ILD layer, wherein individual ones of the first plurality of conductive interconnect lines comprise a first conductive barrier material along sidewalls and a bottom of a first conductive fill material. A second plurality of conductive interconnect lines is in and spaced apart by a second ILD layer above the first ILD layer, wherein individual ones of the second plurality of conductive interconnect lines comprise a second conductive barrier material along sidewalls and a bottom of a second conductive fill material, wherein the second conductive fill material is different in composition from the first conductive fill material.

Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a plurality of conductive interconnect lines in and spaced apart by an inter-layer dielectric (ILD) layer above a substrate. Individual ones of the plurality of conductive interconnect lines have an upper surface below an upper surface of the ILD layer. An etch-stop layer is on and conformal with the ILD layer and the plurality of conductive interconnect lines, the etch-stop layer having a non-planar upper surface with an uppermost portion of the non-planar upper surface over the ILD layer and a lowermost portion of the non-planar upper surface over the plurality of conductive interconnect lines.

Etch-stop layer topography for advanced integrated circuit structure fabrication

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes an inter-layer dielectric (ILD) layer above a substrate. A conductive interconnect line is in a trench in the ILD layer, the conductive interconnect line having a first portion and a second portion, the first portion laterally adjacent to the second portion. A dielectric plug is between and laterally adjacent to the first and second portions of the conductive interconnect line, the dielectric plug comprising a metal oxide material.

Growing community of inventors

Portland, OR, United States of America

Andrew W Yeoh