British Telecommunications Public Limited Company

British Telecommunications Corporation

Andrew W Nelson

Leslie D Westbrook

Simon Cole

Philip J Fiddyment

Richard E Hobbs

Charles G Lenton

Ian F Lealman

Michael J Harlow

William J Devlin

David M Cooper

W John Devlin

W John Deuling

Stanley Y Wong

In a semiconductor buried heterostructure laser having a mesa (2, 3, 4) and confinement layers (5, 6, 7) on a substrate (12), at least the lowermost of the confinement layers (5, 6, 7) is substantially planar up to the mesa. This is achieved by MOVPE growth of InP against lateral surfaces of the mesa (2, 3, 4) which are defined by distinct crystallographic planes of the material of the mesa. In particular (111) B InP planes are used. The laser is particularly for use in the field of optical communications.

Method of manufacturing semiconductor structures

It has been found that layers which include arsenic and/or zinc can have an adverse effect upon optoelectronic semiconductor devices such as lasers. This is reduced by treatments in which arsenic and zinc are excluded. Preferably the substrate is cooled from reaction temperature in the presence of a mixture of hydrogen and PH.sub.3 (replacing AsH.sub.3 and/or Zn(CH.sub.3).sub.2 used to grow the final layer). Alternatively, devices have a contact layer of heavily p-type gallium indium arsenide are improved by the deposition of a protective layer of indium phosphide. This layer is removed immediately before metalization. Even though the protective layer is not present in the final product it has a beneficial effect.

Preparation of semiconductor devices

A semiconductor structure and methods for making it, for use in opto-electronic devices, employs only MOVPE growth steps. The structure is based on a mesa having substantially non-reentrant sides. To make it, an initial semiconductor structure is produced which comprises a substrate with a mesa thereon, the mesa having a self-aligned, central stripe of metal organic vapour phase growth suppressing material on its uppermost surface. Burying layers are then grown by MOVPE at either side of the mesa, the stripe removed, and covering layers grown over the mesa and adjoining regions of the burying layers. To make an opto-electronic device, a silica window can be formed on the uppermost surface of the covering layers and contacts provided through the window and to the remote face of the substrate. Two methods of making the initial semiconductor structure are described. Devices such as optical detectors and waveguides can be made using methods according to the invention. Particularly importantly, semiconductor lasers which will operate in a single transverse mode can be made.

Semiconductor structure with flared mesa burying layers

Semiconductor structures and a method of manufacturing semiconductor

A semiconductor device is disclosed that comprises a base semiconductor portion and, thereon, first and second elevated semiconductor portions separated by a channel. The uppermost surface of the first elevated semiconductor portion carries a metal electrical contact layer and the uppermost of the second a dielectric layer. The surfaces defining the channel are substantially free of metal and dielectric. The structure can be used in a ridge waveguide laser, the first elevated semiconductor portion constituting the ridge. Distributed feedback corrugations may be incorporated in such devices or in other ridge waveguide structures.

Ridge waveguide optical devices

A gas mixture containing phosphine and R.sub.1 R.sub.2 R.sub.3 In X R.sub.4 R.sub.5 R.sub.6 or R.sub.1 R.sub.2 In X R.sub.4 R.sub.5 where the Rs are alkyl groups is passed over a semiconductor substrate comprising indium and phosphorus so as to deposit a semiconductor material comprising indium and phosphorus, and the exposure of the substrate to phosphine is controlled to avoid or reduce transport of the substrate material. Thus, for example, indium phosphide may be grown onto corrugations in gallium indium arsenide phosphide, the corrugations being non-deformed during this growth. Such a growth step may be used in the production of distributed feedback semiconductor lasers operating near 1.55 .mu.m.

Growth of semiconductors on a shaped semiconductor substrate

A semiconductor device comprises a base semiconductor portion and, thereon, first and second elevated semiconductor portions separated by a channel. The uppermost surface of the first elevated semiconductor portion carries a metal electrical contact layer and the uppermost of the second a dielectric layer. The surfaces defining the channel are substantially free of metal and dielectric. The structure can be used in a ridge waveguide laser, the first elevated semiconductor portion constituting the ridge (7', 8'). Distributed feedback corrugations may be incorporated in such devices (6), or in other ridge waveguide structures.

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Felixstowe, United Kingdom

Andrew W Nelson