X Display Company Technology Limited

Andrew Tyler Pearson

Ronald S Cok

Christopher Andrew Bower

Matthew Alexander Meitl

Salvatore Bonafede

Brook David Raymond

Erik Paul Vick

Erich Radauscher

Christopher Michael Verreen

A redundant pixel layout for a display comprises a display substrate and an array of pixels disposed on or over the display substrate. Each pixel comprises a first subpixel and a redundant second subpixel. The first subpixel includes a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire. The first light emitter is controlled by the first subpixel controller through the first-light-emitter wire. The second subpixel includes a second-subpixel-controller location connected to the controller wires and a second-light-emitter location comprising a second-light-emitter wire. The first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.

Redundant pixel layouts

An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.

Modules with integrated circuits and devices

A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.

Structures and methods for electrically connecting printed components

A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

Printed LED arrays with large-scale uniformity

Pixel modules with controllers and light emitters

Printing component arrays with different orientations

Growing community of inventors

Durham, NC, United States of America

Andrew Tyler Pearson