Applied Materials, Inc.

Andrew Tomko

Goichi Yoshidome

Keith A Miller

Martin Lee Riker

Fuhong Zhang

Hamid Tavassoli

Prashanth Kothnur

Wei Lei

Shirish A Pethe

Kishor Kumar Kalathiparambil

Suhas Bangalore Umesh

Sushil Arun Samant

Methods of processing a substrate in a PVD chamber are provided herein. In some embodiments, a method of processing a substrate in a PVD chamber, includes: sputtering material from a target disposed in the PVD chamber and onto a substrate, wherein at least some of the material sputtered from the target is guided to the substrate through a magnetic field provided by one or more upper magnets disposed about a processing volume of the PVD chamber above a support pedestal for the substrate in the PVD chamber, one or more first magnets disposed about the support pedestal and providing an increased magnetic field strength at an edge region of the substrate, and one or more second magnets disposed below the support pedestal that increase a magnetic field strength at a central region of the substrate.

Methods for shaping magnetic fields during semiconductor processing

Embodiments of collimators and process chambers incorporating same are provided herein. In some embodiments, a collimator for use in a substrate processing chamber includes a ring; an adapter surrounding the ring and having an inner annular wall; and a plurality of spokes extending from the inner annular wall and intersecting at a central axis of the collimator.

Collimator for use in a physical vapor deposition chamber

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Santa Clara, CA, United States of America

Andrew Tomko