Lenovo (singapore) Pte. Ltd.

Other

Andrew Thomas Junkins

Paul Theodore Artman

Vinod Kamath

Rodrigo Samper

Vincent Charles Conzola

Jonathan Randall Hinkle

Gerard Francis Muenkel

Jeffrey Scott Holland

Bejoy J Kochuparambil

Chunjian Ni

Jiabing Li

Martin W Hiegl

Marcelo Vinante

Method, system, and computer program product embodiments of heating a flow of liquid by transfer of heat with computing devices. Embodiments also include determining a dynamic cooling capacity index for each of the computing devices, and allocating processing workload among the first computing device and the second computing device based on the dynamic cooling capacity indexes of the computing devices. Embodiments further include allocating workload and/or regulating flow rate of the flow of liquid to maintain a predetermined value or range of values of temperature of the liquid.

Optimizing waste heat recovery and return water temperature using dynamic flow control based on server power profiles and cooling capacity of servers

An interposer includes a planar substrate and a pad array formed on a bottom side of the planar substrate to connect with a pin array within a CPU socket. A serial computer expansion bus connector is formed on the top side of the planar substrate and is electronically coupled to a portion of the pad array. The interposer further includes a perimeter structure adapted for securing to a CPU carrier. The interposer may be included in a kit with a heatsink securable to the CPU socket, wherein the heatsink includes a contact area for contacting the interposer and applying a load to the interposer. A printed circuit board assembly may include first and second CPU sockets that are connected by a CPU interconnect, where the interposer may be installed in the first CPU socket and a CPU may be installed in the second CPU socket.

Interposer for a CPU socket to provide a serial computer expansion bus connection

Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly are disclosed. According to an aspect, a system includes an electronic device including one or more electronic components. Further, the electronic device includes a heat-transfer conduit including a first end and a second end. The first end of the heat-transfer conduit is positioned to receive heat from the electronic component(s). The heat-transfer conduit is configured to conduct heat from the first end to the second end. Further, the system includes a cold plate assembly including a cold plate and a mechanism configured to permit movement of the cold plate. At the first position, the cold plate may contact the second end for receipt of heat from the heat-transfer conduit at the second end. At the second position, the cold plate is apart from the second end.

Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly

Computing devices having slots and components for receipt of different types of peripherals are disclosed. According to an aspect, a computing device includes a body that defines an interior and comprises a rear wall defining a slot that extends into the interior. The slot is sized and shaped for receipt of two or more different types of peripherals. The computing device includes a motherboard that defines another slot being sized and shaped for receipt of the different types of peripherals. The other slot is substantially coplanar with the second slot. The computing device includes a connector operably interfaced with the motherboard and configured to interface with the different types of peripherals.

Computing devices having slots and components for receipt of different types of peripherals

A liquid-cooling mechanism, or sub-system, has a thermally conductive plate in which a cooling liquid channel is disposed, and a thermally conductive pad disposed on the thermally conductive plate. An electronic device is mounted to the thermally conductive pad, such as via a mounting component, in a manner that decreases translational movement of a contact surface of the electronic device against a contact surface of the thermally conductive pad. When mounted to the thermally conductive pad, the electronic device compresses the thermally conductive pad.

Mounting electronic device to thermally conductive pad of liquid-cooling mechanism in translational movement-minimizing manner

A system and method are provided that comprise a circuit board including one or more processors and a chassis that holds the circuit board. The chassis includes a card receptacle that receives an electronics card. The electronics card comprises a card circuit board having electronic components including one or more processors. The card circuit board has a chassis loading end. A heat sink is provided on the circuit board and thermally coupled to one or more electronic components to dissipate heat therefrom. The heat sink has a three-dimensional envelope having a stepped end profile relative to the chassis loading end. Vent openings are provided in shielding of the electronics card for airflow from the electronics card.

System with stepped three dimensional profile and venting

An apparatus with deflectable dividers separating peripheral components is disclosed. The apparatus includes a shroud housing coupleable to a circuit board of a computer. In an installed position, the shroud housing facilitates a proper electrical connection between peripheral components and the circuit board. The apparatus also includes at least one deflectable divider that is deflectably mounted to the shroud housing. In the installed position, the at least one deflectable divider is disposed between adjacent peripheral components. The at least one deflectable divider is operably displaced away from a selected peripheral component in a displacement motion by fingers of a user during a component swap operation to allow space for the fingers of the user to grasp the selected peripheral component.

Deflectable dividers separating peripheral components

A computing assembly comprises an enclosure body having opposite first and second planar surfaces, one or more storage bays operably coupled with the enclosure body (where the one or more storage bays pivot relative to the enclosure body to protrude outward from the first planar surface of the enclosure body), one or more computing node devices at least partially disposed within the enclosure body (where the one or more computing node devices include one or more circuits) and one or more memory devices disposed within the one or more storage bays.

Growing community of inventors

Cary, NC, United States of America

Andrew Thomas Junkins