Motorola Corporation

Nokia Solutions and Networks Oy

Andrew T Morrison

Dale E Ray

Aaron B Mullins

Mark V Anderson

Todd Betz

Earl Ponceti

Michael Bartlett

John L Dascanio, Ii

A connector assembly and heat sink configured to be received by a radio unit are provided. An example connector assembly includes a printed wiring board (PWB) at least partially disposed within the radio unit when in an operational configuration, and the PWB defines an extension at least partially disposed exterior to the radio unit when in the operational configuration. The connector assembly includes one or more optoelectronic components configured to convert between optical signals and electrical signals supported by the PWB, and at least a portion of the one or more optoelectronic components are disposed on the extension of the PWB. The connector assembly also includes a heat sink housing attached to the PWB that encloses the extension of the PWB and optoelectronic components disposed on the extension in order to dissipate heat from the optoelectronic components to an exterior environment of the connector assembly.

Connector assembly and associated heat sink housing for use in a radio unit

An apparatus for providing oscillator frequency stability is disclosed. The apparatus includes an internally ovenized oscillator module having an oscillator and an inner heater to maintain the oscillator at a first temperature during operation. The apparatus also includes a thermally conductive cover for forming a first compartment to contain the internally ovenized oscillator module along with multiple heaters. The heaters are in thermal communication with the thermally conductive cover and the substrate to form an oven to keep the internally ovenized oscillator module at a stable second temperature during operation. In addition, the apparatus includes a thermally insulative cover for forming a second compartment to contain the first compartment.

Apparatus for providing oscillator frequency stability

A circuit carrying substrate (108) accommodates circuit components (102) with different coefficients of expansion and contraction from that of the circuit carrying substrate (108). Beneath the components (102) a plurality of slots (104) are formed so as to minimize the effects of the differing coefficients of expansion and contraction.

Compliancy tolerant pattern for circuit carrying substrate

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Bedford, TX, United States of America

Andrew T Morrison