Hrl Laboratories, LLC

Composite Containers, LLC

Other

Raytheon Company

He Holdings, Inc.

Andrew T Hunter

Peter David Brewer

Jonathan James Lynch

Rajesh D Rajavel

David H Chow

James H Schaffner

Daniel Frederic Sievenpiper

Daniel J Gregoire

Debabani Choudhury

Joseph S Colburn

Joel N Schulman

Yakov Royter

Harris P Moyer

Mehran Matloubian

Carl W Pobanz

Deborah J Kirby

Michael G Case

Jennifer J Zinck

John A Roth

Clifford A Lebeau

Luisa M Deckard

Ronald Stevens

K W Kirby

K C Fuller

A liner for a tank container, wherein the tank container is used for the transportation of cargo such as liquids, gases, and flowable solids. The liner is made of a polymeric material and it is sized to fit within the tank container. The liner is secured to the tank container using flexible gland flanges that are sandwiched between the tank body and the cover of the specific hole.

Liner for tank container

A collapsible container, a method of manufacturing, and a method of using the same is provided herein. In some embodiments, the collapsible container is octagonal, generally square, or generally rectangular while comprising eight side panels have receiving pockets for receiving stiffening panels. The collapsible container may include a third layer sewn to the inside of the walls such that content loaded into the third layer is directed to a spout at the bottom of the third layer for convenient discharge of contents. The eight side panels are designed such that the container can be collapsed for easy transport but also stably supports and facilitates discharge of contents from the third layer when the container is set up.

Silosack container

A heterogeneous integrated circuit and method of making the same. An integrated circuit includes a surrogate substrate including a material selected from the group consisting of Group II, Group III, Group IV, Group V, and Group VI materials and their combinations; at least one active semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials; and at least one transferred semiconductor device including a material combination selected from the group consisting of Group IV-IV, Group III-V and Group II-VI materials. The at least one active semiconductor device and the at least one transferred device are interconnected.

Heterogeneous integrated circuits and devices thereof with a surrogate substrate and transferred semiconductor devices

An interface material employing carbon nanotube (CNT) array and a method of fabricating the same. A first CNT array is provided on a first substrate. A second CNT array is provided on a second substrate. A first support layer is disposed on the first CNT array, wherein the first CNT array is between the first support layer and the first substrate. A second support layer is disposed on the second CNT array, wherein the second CNT array is between the second support layer and the second substrate. The first support layer is attached to the second support layer. The first and second substrates are removed, thereby providing the interface material.

Carbon nanotube array interface material and methods

A flexible, collapsible semi-bulk container for storing and transporting content is provided. The container has the strength to hold up to two tons of contents while being stacked up to five high. The container is also collapsible for ease of storage and transport. In some embodiments, the container includes swing walls that provide support to the side walls when positioned substantially adjacent to them. In another embodiment, the container includes partial swing walls that support cassettes for dividing the container into smaller compartments. In a still further embodiment, the container includes an interior baffle for dividing the container into smaller compartments.

Collapsible semi-bulk container

Game assembly

Method of fabrication of heterogeneous integrated circuits and devices thereof

An optical detector pixel element. The novel pixel element includes a metallic substrate having a plurality of resonant apertures, each aperture adapted to resonantly transmit electromagnetic energy in a distinct frequency band, and a plurality of detectors adapted to detect the energy transmitted by the apertures. Each aperture is adapted to collect energy incident on an area larger than the aperture and focus the energy into a smaller, localized region in which one or more of the detectors is placed. The plural apertures are positioned such that they collect energy incident on a substantially common area, but are of different sizes such that they are resonant to different frequencies. Energy in different frequency bands are therefore funneled through different apertures. In an illustrative embodiment, several identical pixel elements are joined together to form an array.

Multiple-band detector using frequency selective slots

Electronically tunable and reconfigurable hyperspectral IR detectors and methods for making the same are presented. In one embodiment, a reconfigurable hyperspectral sensor (or detector) detects radiation from about 0.4 &#x3bc;m to about 2 &#x3bc;m and beyond. This sensor is configured to be compact, and lightweight and offers hyperspectral imaging capability while providing wavelength agility and tunability at the chip-level. That is, the sensor is used to rapidly image across diverse terrain to identify man-made objects and other anomalies in cluttered environments.

Electronically tunable and reconfigurable hyperspectral photon detector

Low cost millimeter wave imagers using two-dimensional focal plane arrays based on backward tunneling diode (BTD) detectors. Two-dimensional focal arrays of BTD detectors are used as focal plane arrays in imagers. High responsivity of BTD detectors near zero bias results in low noise detectors that alleviate the need for expensive and heat generating low noise amplifiers or Dicke switches in the imager. BTD detectors are installed on a printed circuit board using flip chip packaging technology and horn antennas direct the waves toward the flip chip including the BTD detectors. The assembly of the horn antennas, flip chips, printed circuit board substrate, and interconnects together work as an imaging sensor. Corrugated surfaces of the components prevent re-radiation of the incident waves.

Low cost millimeter wave imager

An integrated communication device having a substrate layer of substantially electrically nonconductive material with two substantially parallel surfaces, an antenna element disposed on one of the surfaces, a ground layer of substantially electrically conductive material disposed on the other surface and having an opening formed therethrough opposite from the antenna element, and a transceiver device mounted to the ground layer to transmit and/or receive electromagnetic energy through the opening.

Integrated phased array antenna

In one of various embodiments, a detector assembly is provided which includes a metallic layer having a repeating pattern of structures over a dielectric substrate. The metallic layer in conjunction with the dielectric substrate form a structure capable of focusing incident radiation to sub-wavelength high field regions. A plurality of detectors are disposed within the dielectric substrate in the high field regions created by the metallic layer. In some embodiments, an array of subwavelength sized detectors may be located in the high field regions.

Sub-wavelength low-noise infrared detectors

Growing community of inventors

Woodland Hills, CA, United States of America

Andrew T Hunter