Aptix Corporation

Andrew Switky

Robert Osann, Jr

An integrated circuit package for demountable attachment to a printed circuit board or like device is formed from an integrated assembly of an IC chip and socket, The IC chip is permanently mounted to a chip carrier which spreads the contact area from a first area to a larger second area. The chip carrier or spreader is contained in a plastic socket formed of a cover and a base. The base has an array of apertures therethrough each of which is equipped with wadded wire/plunger contacts for conformal contact with both pads on the bottom of the chip carrier and pads on a circuit board.

Integrated socket and IC package assembly

A package for one or more integrated circuit dice which includes a spreader which provides a conventional signal path between the die and a printed circuit board to which it is demountably attached as well as an additional, more readily accessible subset of signals, preferably available through a flexible cable extending horizontally from the package. The spreader provides a first set of contacts on a first side for interface to the integrated circuit dice, a second set of contacts on a second side opposite the first side which are connected to some of the contacts of the first set of contacts for connection to the printed circuit board, and a third set of contacts on the first side along one edge thereof for engaging the flexible cable and carrying the subset of signals.

Growing community of inventors

Palo Alto, CA, United States of America

Andrew Switky