University of Illinois

Andrew Stillwell

Nenad Miljkovic

Robert Pilawa-Podgurski

Tarek Gebrael

Patrick Birbarah

Thomas Foulkes

A cooling system includes a container having a water-based fluid in which are immersed printed circuit boards (PCBs). One or more high-thermal electrical components are disposed on the PCBs. A condenser causes water vapor generated by the one or more high-thermal electrical components to condense and passively return to the water-based fluid. A nano-engineered coating is deposited over the one or more high-thermal electrical components that includes an electrical insulation coating of between two to 25 microns in thickness deposited on the one or more high-thermal electrical components. A metallic nano-layer comprising a porous metallic nano-structure deposited on the electrical insulation coating.

Immersion cooling with water-based fluid using nano-structured coating

A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.

Growing community of inventors

Champaign, IL, United States of America

Andrew Stillwell