Delphi Technologies, Inc.

Andrew R Hayes

Mohinder Singh Bhatti

Ilya Reyzin

Shrikant Mukund Joshi

Ralph S Taylor

Erich William Gerbsch

Mark Joseph Parisi

Lawrence P Scherer

Jeffrey J Ronning

Michael A Jeter

Roger A Mock

The invention provides a heat sink for flowing coolant into inlet manifold channels extending into a inlet edge of a manifold where the flow is forced downward into parallel and spaced micro-channels extending across the manifold channels and re-directing the coolant up into and out of outlet manifold channels extending into an outlet edge of the manifold and interleaved with the inlet manifold channels, and by maintaining a base-width of the micro-channels in the range of forty microns to one hundred microns, maintaining a base-height of the micro-channels in the range of two hundred microns to four hundred microns, maintaining a manifold-height through of the manifold channels in the range of one thousand microns to three thousand microns, and maintaining a manifold-width of the manifold channels in the range of three hundred and fifty microns to one thousand microns.

Microchannel heat sink

The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also includes a finger member having a rounded tip centered on the top surface. The heat sink device also includes a force generating device having an anvil spaced from the finger member and a compressible member compressed between the anvil and the finger member. The compressible member generates a pressing force urging the finger member and the top surface together. The heat sink device also includes a moving device operable to move one of the anvil and the finger member relative to the other to change the pressing force generated by the compressible member.

Apparatus for controlling thermal interface between cold plate and integrated circuit chip

An electronics assembly is provided, including a housing and at least one electronic power device positioned within. A heat sink device is positioned within the housing and is in thermal communication with the electronic power device . The heat sink device includes a fluid vessel , a fluid input port , a fluid output port , and at least one fin insert brazed into the fluid vessel . The heat sink device is in fluid communication with an automotive radiator such that coolant flows from the automotive radiator through the fluid vessel thereby cooling the electronic power device

Automotive electronics heat exchanger

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Clarence Center, NY, United States of America

Andrew R Hayes