Hutchinson Technology Corporation

Andrew R Dick

Jeffery D Weckwerth

Douglas P Riemer

Treatment solutions and methods for treating a substrate including forming a first layer on a surface of the substrate, providing a process gas to the one or more plasma sources, the process gas includes a gas mixture of a reactive gas species and an inert gas species; forming a plasma under vacuum in the one or more plasma sources; and exposing the substrate to the plasma under vacuum to treat the first layer on the surface of the substrate.

Surface treatment producing high conductivity vias with simultaneous polymer adhesion

Photosensitive polymer formulations, materials and uses of such materials are disclosed. Embodiments of the present disclosure provide photosensitive polyimide materials having chain extenders and formulations thereof that improve elongation and formability of the polyimide materials, and methods of making such polymer materials.

Growing community of inventors

Eau Claire, WI, United States of America

Andrew R Dick