University of Illinois

Cypress Semiconductor Corporation

Andrew Price

J Gary Eden

Sung-Jin Park

Jason D Readle

James Franklin Price, Iii

Robert Douglas Thompson

Clark J Wagner

Avijit Dutta

Krishnan Anandh

Joseph P Skudlarek

JeKwon Yoon

Neil Tuttle

Jeffrey Putney

Kwang Soo

An attachment device for floor shaving systems includes a machine mounting coupler and a tool receptacle that are joined at a compound angle to position a scraping tool off the center axis of a scraping machine. The mounting coupler is constructed from solid steel bar and has a shape and a size that is complementary to the tool receiver of a scraping machine and is secured within the receiver via a mounting pin. The tool receptacle is constructed from steel and includes a hollow channel with a magnet on one end and an opening on the other end for receiving and engaging the shaft of a scraping tool and permitting the same to rotate 360 degrees. The mounting coupler and tool receptacle are joined at an angle of 11 degrees to permit the blade of the tool to engage expansion joint intersections diagonally to prevent damage to concrete.

Attachment device for floor shaving systems

Techniques for placement in highly constraint chip architectures are described herein. In an example embodiment, a computer system places a digital portion of an electronic design for a programmable chip. The programmable chip comprises multiple fixed-function blocks and a plurality of pins, where each one of the multiple fixed-function blocks can be coupled only to a respective subset of the plurality of pins. The electronic design comprises a particular fixed-function block (FFB) instance that is connected to a particular input-output (IO) instance. The computer system places (e.g., by using a backtracking search) the particular FFB instance on a particular fixed-function block and the particular IO instance on a particular pin from a particular subset of the plurality of pins, where in the programmable chip the particular fixed-function block can be coupled only to the particular subset of the plurality of pins.

Techniques for placement in highly constrained architectures

Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.

Variable electric field strength metal and metal oxide microplasma lamps and fabrication

An embodiment of the invention IS an array of microcavity plasma devices The array includes a first metal film electrode with a plurality of non-uniform cross-section microcavities therein that are encapsulated in oxide A second electrode is a thin metal foil encapsulated in oxide that is bonded to the first electrode A packaging layer contains gas or vapor in the non-uniform cross-section microcavities To make such device, photoresist is patterned to encapsulate the anodized foil or film except on a top surface at desired positions of microcavities A second anodization or electrochemical etching is conducted to form the non-uniform cross-section sidewall microcavities cavities After removing photoresist and metal oxide, a final anodization lines the walls of the microcavities with metal oxide and fully encapsulates the metal electrodes with metal oxide.

Microcavity plasma devices with non-uniform cross-section microcavities

Embodiments of the invention provide for large arrays of microcavity plasma devices that can be made inexpensively, and can produce large area but thin displays or lighting sources Interwoven metal wire mesh, such as interwoven Al mesh, consists of two sets of wires which are interwoven in such a way that the two wire sets cross each other, typically at &#x3c0;ght angles (90 degrees) although other patterns are also available Fabrication is accomplished with a simple and inexpensive wet chemical etching process The wires in each set are spaced from one another such that the finished mesh forms an array of openings that can be, for example, square, rectangular or diamond-shaped The size of the openings or microcavities is a function of the diameter of the wires in the mesh and the spacing between the wires in the mesh used to form the array of microcavity plasma devices.

Interwoven wire mesh microcavity plasma arrays

Growing community of inventors

Savoy, IL, United States of America

Andrew Price