Hewlett Packard Enterprise Development LP

Andrew Potter

Michael S Bunker

Timothy A McCree

Troy Anthony Della Fiora

John Robert Grady

Stephen Spencer

Raghavan V Venugopal

Chin-Lung Chiang

Jyun-Jie Wang

Patrick A Raymond

James Jeffery Schulze

Chong Sin Tan

Daniel W Tower

Sunil Ganta

Arthur G Volkmann

Meng-Chen Wu

An air baffle assembly for air cooling in computer systems is described. The air baffle assembly can include a baffle body removably installed on a printed circuit assembly deployed on a chassis. The baffle body can cover memory components. The air baffle assembly can also include an air dam removably installed on the baffle body. The baffle body has a slot positioned on a side of the baffle body, which can be substantially parallel to a wall of the chassis. The baffle body can further include alignment rails positioned in the slot to guide installation of the air dam into the slot. The installed air dam can reduce a bypass region, thereby reducing airflow through the bypass region and increasing airflow through the memory components.

Removable air dams for air cooling in computer systems

Example implementations relate to a computing system having a chassis and a front panel pivotably coupled to the chassis via a pair of retention brackets. In some examples, the chassis has a pair of frames that is disposed spaced apart and in parallel to each other. Further, each retention bracket of the pair of brackets is movably coupled to a respective frame of the pair of frames. The front panel is releasably engaged to the pair of frames and pivotably coupled to the pair of retention brackets such that the front panel is movable independently relative to the chassis. During installation and maintenance of the computing system, the front panel is movable linearly along a radial direction relative to the pair of frames and rotatable independently relative to the pair of retention brackets so as to provide clearance for accessing interiors of the chassis.

Computing system having a pivotable front panel

A storage drive adapter may comprise an adapter board, which may include a first and second carrier module interface to removably engage with a first and a second storage drive carrier module, respectively. The adapter board may further include a dual ported storage drive connector to engage with a complementary storage drive bay interface. The dual ported storage drive connector may include a first port to provide a first signal path from the complementary storage drive bay interface to the first carrier module interface. Similarly, the dual ported storage drive connector may also include a second port to provide a second signal path from the complementary storage drive bay interface to the second carrier module interface.

Storage drive adapter

Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.

Heatsink with retention mechanisms

An example carrier module may include a carrier board. The carrier board may include a storage drive interface and an adapter connector in electrical communication with the storage drive interface. The adapter connector may engage with a complementary adapter receiver. The adapter connector may include a plurality of signal pins, at least one ground pin that is longer than the signal pins, and at least one power pin that is longer than the signal pins. The plurality of signal pins, the at least one ground pin, and the at least one power pin may engage with the adapter receiver to facilitate electrical communication between the adapter receiver and the adapter connector.

Storage drive carrier module

A Next Generation Form Factor (NGFF) carrier includes a flat component perpendicularly connected to two flat side components to receive an NGFF module, a bar rotatably connected to the two flat side components, and a number of holds along an interior of the flat component to receive a fastener. The NGFF module is insertable in relation to the flat component when the bar is rotated to a first position and fixed on the flat component when the bar is rotated to a second position.

Next generation form factor (NGFF) carrier

In one example a latching system is disclosed. The latching system has a handle that moves along an axis of motion between three positions: a latched position, an unlatched position and an engaged position. The handle moves a retention clip from a locked position into an unlocked position when the handle moves from the unlatched position into the engaged position.

Latching system

A Next Generation Form Factor (NGFF) connector apparatus can include a plurality of upper signal pins and an upper ground (GND) pin that is longer than other upper pins. The NGFF connector apparatus can also include a plurality of lower signal pins and a lower power (PWR) pin that is longer than other lower pins.

Next generation form factor connector

An example carrier module may comprise a carrier board, which may include a storage drive interface. The storage drive interface may engage with a storage drive so the storage drive can electrically communicate with the storage drive interface. The carrier board may further include an adapter connector in electrical communication with the storage drive interface. The adapter connector may removably engage with a complementary adapter receiver and may include multiple signal pins, and a ground pin and a power pin which are longer than the signal pins. The pins may facilitate electrical communication between the adapter receiver and the adapter connector. The carrier board may also include a power storage component in electrical communication with the storage drive interface and the adapter connector. The power storage component may receive and store a power input from the adapter receiver and may provide the power input to the storage drive interface.

Growing community of inventors

Houston, TX, United States of America

Andrew Potter