Texas Instruments Corporation

Andrew Patrick Couch

John Paul Tellkamp

David Anthony Graham

Phillip Marcus Blitz

Chi-Tsung Lee

Chien-Lin Wu

Ming-Chuan You

A packaged multichip isolation device includes leadframe including a first and second die pad, with a first and second lead extending outside a molded body having a downward extending lead bend near their outer ends. A first integrated circuit (IC) die on the first die pad has a first bond pad connected to the first lead that realizes a transmitter or receiver. A second IC die on the second die pad has a second bond pad connected to the second lead that realizes another of the transmitter and receiver. An isolation component is in a signal path of the isolation device including a capacitive isolator, or inductors for transformer isolation on or between the die. A midpoint of the thickness of the die pad is raised above a top level of the leads and in an opposite vertical direction relative to the downward extending bend of the external leads.

Inverted leads for packaged isolation devices

An integrated circuit testing assembly, comprising a slab having a slab axis, and a first electrode and second electrode affixed relative to the slab. The first electrode has a first major axis parallel to the slab axis, is coupled to receive a first voltage for coupling to a first set of pins on an integrated circuit, and includes a first surface area facing the slab axis, wherein the first surface area does not include a surface discontinuity. The second electrode has a second major axis parallel to the slab axis, is coupled to receive a second voltage for coupling to second first set of pins on an integrated circuit, and includes a second surface area facing the slab axis, wherein the second surface area does not include a surface discontinuity.

High voltage integrated circuit testing interface assembly

A handler for holding an electronic device during high voltage testing includes conductive lead guides for shorting leads on one side of the isolator together and connectors connecting the lead guides to conductors.

Growing community of inventors

Garland, TX, United States of America

Andrew Patrick Couch