Infineon Technologies Austria Ag

Commscope Technologies LLC

Commscope Connectivity UK Limited

Infineon Technologies Ag

Andrew P Roberts

Martin Standing

Michael Gregory German

Ryan E Enge

Matias Peluffo

Peter Smith

Eric W Sybesma

Robert J Clarke

Marcus Pawley

Ernest C Pickens

Gene Malone

Masood Shariff

Milko Paolucci

Kevin David Townend

Alexander Thomas

One embodiment is directed to detecting that a cable has been connected to a port of patching equipment and detecting that the cable is no longer connected to said port. In response to detecting that the cable is no longer connected, information associated with fixed cabling coupled to said port that is captured by a cable tester is downloaded to a controller. The downloaded information is associated with said port and the downloaded information and association information is locally stored at the controller. The locally stored information can then be used to create and/or populate objects in a database. Another embodiment is directed to including a storage device and a wireless interface in patching equipment or other equipment such as an outlet or consolidation point for use in writing information to the storage device and reading information from the storage device via the wireless interface. Other embodiments are disclosed.

Automated capture of information about fixed cabling

One embodiment is directed to a 'software only' hosted or cloud-based physical layer management (PLM) system. Another embodiment is directed to a hosted or cloud-based PLM system or Automated Infrastructure Management (AIM) system that uses a hardware appliance that is locally deployed in an enterprises network. Other embodiments are disclosed.

Hosted physical layer management or automated infrastructure management system having software only configuration and/or local hardware appliance

A work order is generated. The work order comprises a first work order step specifying that a port of a first network element is to be connected to a port of a second network element using a cable. The first and second network elements are configured to detect when connections are made at the specified ports of the first network element and the second network element. A management system is configured to update information it maintains to indicate that there is a connection between the specified port of the first network element and the specified port of the second network element if connections made at the specified ports of the first and second network elements are detected during a period in which the first work order step of the first work order is expected to be performed. A similar technique can be used for disconnecting a cable.

Inferring physical layer connection status of generic cables from planned single-end connection events

In an embodiment, an electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact layer protruding from a first side face of the dielectric core layer. The contact layer includes an electrically insulating layer and at least one contact pad arranged on the electrically insulating layer. The at least one contact pad is electrically coupled with the power semiconductor device.

Electronic component, system and method

Systems and methods for physical layer access control are provided. In one embodiment, a method using an automated infrastructure management system comprising a portable device, a management system and a secured equipment cabinet comprises: scanning an asset ID tag with the portable device to obtain asset ID data; transmitting the asset ID data to the management system; verifying whether the asset ID data is associated with an electronic lock identified by an electronic work order, where the work order defines tasks involving a network device within the cabinet; scanning a fingerprint with the portable device to obtain fingerprint ID data; and verifying whether the fingerprint ID data matches an authorized technician. When the asset ID data is verified as associated with the electronic lock and the fingerprint ID data is verified as matching the authorized technician, sending an electronic command from the management system that unlocks the electronic lock.

Remote electronic physical layer access control using an automated infrastructure management system

An assembly includes a first laminate electronic component and a second laminate electronic component. The first laminate electronic component includes a first dielectric layer, at least one first semiconductor die embedded in the first dielectric layer and at least one first contact pad including a first conductive via. The second laminate electronic component includes a second dielectric layer, at least one second semiconductor die embedded in the second dielectric layer and at least one second contact pad including a second conductive via. The first conductive via is electrically coupled to the second conductive via by a common conductive layer.

Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer

In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot.

Method of inserting an electronic component into a slot in a circuit board

In an embodiment, a method includes arranging a first carrier on a first major surface of a circuit board such that an electronic component arranged on the first carrier is positioned in an aperture in the circuit board and spaced apart from side walls of the aperture, and arranging a second carrier on a second major surface of the circuit board such that the second carrier covers the electronic component and the aperture, the second major surface of the circuit board opposing the first major surface of the circuit board. The electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact pad arranged on a first major surface of the dielectric core layer.

System and method of providing a semiconductor carrier and redistribution structure

Representative implementations of devices and techniques provide off-board power conversion. A power cable is arranged to distribute power from a power supply to a peripheral component. An active circuit is integrated into the cable, converting the power en route from the power supply to the peripheral component.

Power in lead

Representative implementations of devices and techniques provide improved electrical performance of components, such as chip dice, for example, disposed on different layers of a multi-layer printed circuit board (PCB). In an example, the components may be embedded within layers of the PCB. An insulating layer located between two component layers or sets of layers includes a conductive portion that may be strategically located to provide electrical connectivity between the components. The conductive portion may also be arranged to improve thermal conductivity between points of the PCB.

High performance vertical interconnection

In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate substrate has a front side and an opposite back side. A plurality of first dies is placed within the first plurality of die openings. An integrated spacer is formed around each die of the plurality of first dies. The integrated spacer is disposed in gaps between the laminate substrate and an outer sidewall of each die of the plurality of first dies. The integrated spacer holds the die within the laminate substrate by partially extending over a portion of a top surface of each die of the plurality of first dies. Front side contacts are formed over the front side of the laminate substrate.

Semiconductor packages and methods of forming the same

Representative implementations of devices and techniques provide a semiconductor package comprising a laminate substrate. The laminate substrate includes at least one conductive layer laminated to a surface of an insulating core. The laminate substrate also includes one or more die openings, in which one or more semiconductor die are located.

Method for fabricating a semiconductor package

Embodiments relate to active devices embedded within printed circuit boards (PCBs). In embodiments, the active devices can comprise at least one die, such as a semiconductor die, and coupling elements for mechanically and electrically coupling the active device with one or more layers of the PCB in which the device is embedded. Embodiments thereby provide easy embedding of active devices in PCBs and inexpensive integration with existing PCB technologies and processes.

Growing community of inventors

Wrexham, United Kingdom

Andrew P Roberts