Lockheed Martin Corporation

Andrew O Stringer

Scott Edwin Hinnershitz

Bryan Christopher Baraclough

An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of the frame. A first opening to the fluid flow path is at a first end of the frame; and, a second opening to the fluid flow path at a second end of the frame. The first and second ends of the frame are configured to interchangeably receive components for forced air conduction cooling and components for liquid conduction cooling through the fluid flow paths.

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Apopka, FL, United States of America

Andrew O Stringer