Stmicroelectronics Gmbh

Stmicroelectronics (research & Development) Limited

Stmicroelectronics S.r.l.

Stmicroelectronics R&d Limited

Stmicroelectronics (grenoble 2) Sas

Stmicroelectronics N.v.

Other

Siemens Aktiengesellschaft

Sgs-thomson Microelectronics Limited

Inmos Limited

Advanced Risc Machines Limited

Philips Electronics N.v.

Matra Mhs S.a.

Andrew Michael Jones

Stuart Ryan

Michael David May

David Alan Edwards

John A Carey

Anthony Willis Rich

Alberto Scandurra

Atsushi Hasegawa

Ignazio Antonino Urzi

Bernard Ramanadin

Philippe D'Audigier

Olivier Sauvage

John Carrey

David Walter Flynn

William Bryan Barnes

Glenn Ashley Farrall

Mark Owen Homewood

Andrew Craig Sturges

Thomas Niedermeier

Andrew Keith Betts

Brian Foster

Peter Malcolm Barnes

Bruno Douady

Peter Klapproth

Peter Rohm

Jacobus Christophorus Koot

Frederik Zandveld

James Graham Matthew

Richard Schmid

Stuart Andrew Ryan

A package includes a first die and a second die. The dies are connected to each other through an interface. At least one of the first and second dies includes a plurality of signal sources, wherein each source has at least one quality of service parameter associated therewith, and a plurality of queues having a different priorities. A signal from a respective one of the signal sources is allocated to one of the plurality of queues in dependence on the at least one quality of service parameter associated with the respective signal source. The interface is configured such that signals from said queues are transported from one of said first and second dies to the other of said first and second dies.

Integrated circuit package with multiple dies and queue allocation

Systems and methods are disclosed that comprise a cache memory for storing a copy of a portion of data stored in a system memory and a cache load circuit capable of retrieving the portion of data from the system memory. The systems and methods further comprise a status memory for identifying whether or not a region of the cache memory contains data that has been accessed from the cache memory by an external device.

Cache memory system

Systems and methods for pre-fetching data are disclosed that use a cache memory for storing a copy of data stored in a system memory and mechanism to initiate a pre-fetch of data from the system memory into the cache memory. The system further comprises an event monitor for monitoring events that is connected to a path on which signals representing an event are transmitted between one or more event generating modules and a processor. In some embodiments, the event monitor initiates a pre-fetch of a portion of data in response to the event monitor detecting an event indicating the availability of the portion of data in the system memory.

Cache pre-fetching responsive to data availability

A package includes a first die and a second die. An interface connects the first die and the second die. At least one of the first and second dies includes a memory. The interface is configured to transport both control signals and memory transactions. A multiplexing circuit multiplexes the control signals and the memory transactions onto the interface such that connections of the interface are shared by the control signals and the memory transactions.

Integrated circuit package with multiple dies and a multiplexed communications interface

A circuit including an initiator of a transaction, an interconnect, and a controller. The controller is configured in response to a condition in a least one first part of the circuit to send a notification via the interconnect to at least one block in a second part of the circuit. The notification includes information about the condition in the first part of the circuit, the condition preventing a response to the transaction from being received by the initiator.

Circuit

A first cache arrangement including an input configured to receive a memory request from a second cache arrangement; a first cache memory for storing data; an output configured to provide a response to the memory request for the second cache arrangement; and a first cache controller; the first cache controller configured such that for the response to the memory request output by the output, the cache memory includes no allocation for data associated with the memory request.

Cache arrangement

A first arrangement including an interface configured to receive transactions with an address from a second arrangement having a first memory space; a translator configured to translate an address of a first type of received transaction to a second memory space of the first arrangement, the second memory space being different to the first memory space; and boot logic configured to map a boot transaction of the received transactions to a boot region in the second memory space.

IC with boot transaction translation and related methods

An integrated circuit (IC) may include a cache memory, and a cache memory controller coupled to the cache memory. The cache memory controller may be configured to receive a cache miss associated with a memory location, issue pre-fetch requests, each pre-fetch request having a quality of service (QoS), and determine if a pre-fetch request has issued for the memory location associated with the cache miss.

Cache memory controller

A method may include receiving, at a first integrated circuit die, a memory transaction having an address from a second integrated circuit die. The method may further include determining, at the first integrated circuit die and based on the address, if the transaction is for the first integrated circuit die and, if so, translating the address. If transaction is for a third integrated circuit die, the transaction may be transmitted, without modification to the address, to the third integrated circuit die. The translation may be based upon a first table with each entry including a first address and a second translated address corresponding to the first address, and a second table with each entry including a first address and an indication if the transaction is to be forwarded without modification to the address.

Integrated circuit system providing enhanced communications between integrated circuit dies and related methods

An arrangement includes a first part and a second part. The first part includes a memory controller for accessing a memory, at least one first cache memory and a first directory. The second part includes at least one second cache memory configured to request access to said memory. The first directory is configured to use a first coherency protocol for the at least one first cache memory and a second different coherency protocol for the at least one second memory.

Arrangement

Systems and methods are disclosed for pre-fetching data into a cache memory system. These systems and methods comprise retrieving a portion of data from a system memory and storing a copy of the retrieved portion of data in a cache memory. These systems and methods further comprise monitoring data that has been placed into pre-fetch memory.

Cache memory system including selectively accessible pre-fetch memory for pre-fetch of variable size data

A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport a plurality of control signals. The number of control signals is greater than a width of the interface. At least one of the first and second dies performs a configurable grouping so as to provide a plurality of groups of control signals. The signals within a group are transmitted across the interface together.

Integrated circuit package with multiple dies and bundling of control signals

A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport both control signals and memory transactions. A multiplexer is provided to multiplex the control signals and memory transactions onto the interface such that a plurality of connections of said interface are shared by the control signals and the memory transactions.

A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport both control signals and memory transactions. A sampling circuit samples the control signals before transport on the interface. The sampling circuit is controlled in dependence on at least one quality of service parameter associated with a respective control signal.

Integrated circuit package with multiple dies and sampled control signals

A package includes a die and at least one further die. The die has an interface configured to receive a transaction request from the further die via an interconnect and to transmit a response to the transaction request to said further die via the interconnect. The die also has mapping circuitry which is configured to receive the transaction request including at least first source identity information, wherein the first source identity information is associated with a source of the transaction request on the further die. The mapping circuitry is configured to modify the transaction request to replace the first source identity information with local source identity information, wherein that local source identity information is associated with the mapping circuitry. The mapping circuitry is configured to modify the received transaction request to provide said first source identity information in a further field.

Growing community of inventors

Bristol, United Kingdom

Andrew Michael Jones