Hewlett-packard Development Company, L.p.

Hewlett-packard Company

American Hospital Supply Corporation

Andrew Michael Cherniski

James J deBlanc

Alisa C Sandoval

Herbert J Tanzer

David Dickey

Kirk Yates

Robert William Dobbs

James Kristian Koch

Donald George Pauser

Andrew Harvey Barr

Stephan Karl Barsun

Ricardo Ernesto Espinoza-Ibarra

Glenn Cochran Simon

James David Hensley

Michael Leslie Wortman

Kristina Lynn Mann

Kevin Edward Boyum

Kevin N Smith

Brad E Clements

Andrew H Dickson

Richard W Hanaway

Benjamin Thomas Percer

James C Hathaway

John Malvern Swope

Rodrigo Bainotti

Gerald Jerome Nelson

Jeff Evans

William P Armes

A channel is created within a planar layer. At least a portion of an optical path is formed within the channel. An optical core medium may be deposited into the channel. In various embodiments, reflective layers are deposited within and over the channel to form the optical path. In another embodiment, a photosensitive sheet is exposed to an optical path mask in the presence of an optical source to define an optical path lying within the plane of the sheet.

Planar layer with optical path

An apparatus in one example comprises a reversible fan of an electronic module that rotates in a clockwise direction if the electronic module is communicatively coupled in a first position and a counterclockwise direction if the electronic module is communicatively coupled in a second position.

Reversible fan of electronic module

An optical cross connect includes first and second planar layers having m and n optical path(s), respectively. An optical switch array comprising a plurality of optical switches is disposed to enable optically coupling any optical path of the first planar layer with any optical path of the second planar layer. Techniques for creating a variety of optical path types are provided.

Methods and apparatus for selectively coupling optical paths

A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Conductive contamination reliability solution for assembling substrates

A converter assembly comprises a backplane interface to a backplane compliant with a first open architecture modular computing system standard, a component interface capable of coupling to a component compliant with a second open architecture modular computing system standard, and a control element. The control element is coupled between the backplane interface and the component interface and is capable of programmably routing connection lines and signals between the component interface and the backplane interface.

Form factor converter and tester in an open architecture modular computing system

A power system provides for redundant input power sources. The power system includes a plurality of inputs that are connectable to a plurality of input sources and an OR circuit coupled to the source inputs. The OR circuit ORs the input sources to provide a source voltage. The power control circuit that is responsive to sufficient source voltage and other commands provides a working voltage to mid- and low-rail converters to provide supply voltages for use by a load.

Redundant input power system

A resilient, electrically conductive EMI gasket is disposed between two jaws. A cam-lever or other actuator is operably linked to the jaws. The cam-lever can be used to drive the jaws closer together, thereby squeezing the gasket and causing a portion of the gasket to protrude, preferably beyond an edge of at least one of the jaws. The protruding portion of the gasket contacts a mating surface of an opening, through which a device was installed, or a mating surface on an adjacent device. This contact seals the space between the EMI gasket mechanism and the mating surfaces, i.e. the contact closes a gap and thus maintains a continuous EMI shield therebetween. The gap is closed against passage of EMI radiation without relying on device insertion force to cause the EMI gasket to adequately contact the mating surface. Alternatively, an inflatable resilient EMI gasket is in fluid communication with a pump, and an actuator is operably linked to the pump. The actuator can be used to operate the pump and, thereby, inflate the gasket, thus causing a portion of the gasket to protrude and contact a mating surface.

Expandable electromagnetic interference (EMI) gasket mechanism

An electrical device having an enclosure in which noise is parasitically induced in a wire located in the interior of the enclosure is disclosed. The electrical device has an entry connector for mating the wire with an external connector at which a transmission line terminates for preventing the induced noise from being emitted from the device enclosure via the transmission line. The electrical device comprises a printed circuit board (PCB) adapted to be mounted adjacent to an opening in a wall of the enclosure, a receptacle, integral with the PCB, configured to mate with the external connector, a first conductive path coupling the transmission line with the wire when mated, and capacitors mounted on the printed circuit board radially disposed around the receptacle and adapted to be electrically coupled to the external connector when mated. The electrical device further comprises a second conductive path coupling the capacitors to a low potential sink.

Filtering electromagnetic interference from low frequency transmission lines at a device enclosure

A computer data bus interface control selectively connects a computer data bus to functional components of a circuit board or isolates the bus from the functional components. The bus interface control also selectively provides pull-up voltage to the bus, as needed. The connection selection and the pull-up voltage selection can be made, for example, based on whether the board is installed in a system slot or a peripheral slot of the bus.

Computer data bus interface control

A circuit that allows selection of a power source among a plurality of power sources is disclosed. In an embodiment, either one or both voltage sources Vand Vmay be available in a system. If both sources are available, then the circuit enables the system to use source V. However, if only one of the two sources is available, then the circuit enables the system to use that available source.

Electrical circuit for selecting a desired power source

A method of forming an optical communication path includes forming an optical path for carrying optical communications. An electrically conductive cladding is formed along the optical path for carrying at least one of electrical power, control, and data along the optical path.

Optical path with electrically conductive cladding

An apparatus for terminating a transmission line includes a terminating circuit coupled to a first connector portion. A second connector portion mates with the first connector portion. The second connector portion is coupled in electrical contact with the transmission line and includes one or more components, such as pins, that can radiate unwanted electromagnetic interference (EMI) when the transmission line is not terminated. The terminating circuit includes components, such as one or more resistors, that substantially match the impedance of the transmission line. The terminating circuit can also be configured to terminate other conductive lines that can pick up signal noise in a system. The terminating apparatus can be utilized on operational boards that plug into devices such as backplanes or mid-planes. Alternatively, the terminating circuit can be included on a null device or built into the first connector portion.

Apparatus for terminating transmission lines to reduce electromagnetic interference in an electronic system

A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Method for fabricating a filament affixed trace within an electronic device

A cable emission reduction apparatus includes a conductive cable core, a filter, and a cable shield. The conductive cable core extends longitudinally from a first end to a second end. The filter is coupled to and encases the conductive cable core, and extends longitudinally only a portion of the conductive cable core length, positioned between the first end and the second end. The cable shield is coupled to and encases the conductive cable core and the filter. The cable shield extends longitudinally from the first end over the filter and terminating prior to the second end.

Growing community of inventors

Rescue, CA, United States of America

Andrew Michael Cherniski