Lexmark International, Inc.

Funai Electric Company Ltd.

Other

Andrew McNees

David L Bernard

John William Krawczyk

Paul William Dryer

James M Mrvos

Richard Lee Warner

Sean Terrance Weaver

Carl Edmond Sullivan

Girish Shivaji Patil

Jason Todd Vanderpool

Karthik Vaideeswaran

Timothy Lowell Strunk

Christopher John Money

Frank Edward Anderson

James Daniel Anderson, Jr

David Christopher Graham

Burton Lee Joyner, Ii

Mark Doerre

Eric Spencer Hall

Tim Frasure

Steven Robert Komplin

James Harold Powers

David Golman King

Gary Raymond Williams

Jiandong Fang

Cory Nathan Hammond

Paul W Graf

Christopher Allen Craft

David Bruce Rhine

Shauna Marie Leis

James D Anderson Jr

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method.

Method for fabricating fluid ejection device

A fluidic ejection cartridge is disclosed. The cartridge includes a cartridge body having an upper portion, a lower portion, at least one sidewall, and a hollow cavity within the cartridge body defining a fluid reservoir. The cartridge also includes a cartridge lid disposed over and sealed to the upper portion of the cartridge body, as well as a cartridge bottom plate disposed under and sealed to the lower portion of the cartridge body. A cartridge nosepiece is disposed under and sealed to the cartridge bottom plate. This nosepiece includes at least one fluidic ejection chip in fluid flow communication with the fluid reservoir. According to the present disclosure, the cartridge body, the cartridge lid, and the cartridge bottom are each made from ceramic.

Fluidic ejection cartridge with molded ceramic body

A fluidic delivery device having improved volumetric efficiency. The device includes a fluid container having a standpipe at a lower end of the container and open areas located below a fluid entrance end of the standpipe; a first fluid permeable body located in the fluid container above the fluid entrance end of the standpipe; and one or more second fluid permeable bodies located in the open areas of the fluid container below the first fluid permeable body and below the fluid entrance end of the standpipe.

Fluid delivery devices

A fluidic delivery device includes a fluid supply containing a fluid, the fluid supply has a fluid reservoir and a pair of fluid permeable compressible bodies located in the fluid reservoir. One of the fluid permeable compressible bodies has an effective greater density than the other fluid permeable compressible body.

Fluid delivery devices having improved efficiency in delivering fluid with reduced wastage of fluid

A fluid ejection head and a method of making a fluid ejection head. The method includes providing a semiconductor substrate containing a plurality fluid ejection actuators on a device surface thereof. The substrate is reactive ion etched to form one or more fluid supply vias therein. A flow feature layer is laminated to the substrate and is exposed to ultra violet (UV) radiation through a photo mask to provide UV exposed areas of the flow feature layer. The flow feature layer is heated to cross-link material in the UV exposed areas. A nozzle plate layer is laminated to the flow feature layer and exposed to UV radiation through a photo mask to provide UV exposed areas for nozzle holes. The nozzle plate layer is cross-linked with heat and the flow feature layer and nozzle plate layer are developed to form the flow features and nozzle holes in the respective layers.

Fluid ejection head and process for making a fluid ejection head structure

A fluidic dispensing device includes a housing having an exterior wall and a chamber. The exterior wall has a chip mounting surface defining a first plane and has an opening. The chamber has a port coupled in fluid communication with the opening. An ejection chip is mounted to the chip mounting surface and is oriented along the first plane, and is in fluid communication with the opening. The ejection chip has a fluid ejection direction that is substantially orthogonal to the first plane. A stir bar is located in the chamber, and has a rotational axis. The rotational axis of the stir bar is oriented in an angular range of perpendicular, plus or minus 45 degrees, relative to the fluid ejection direction.

Fluidic dispensing device having a stir bar

A method for fabricating a fluid ejection device includes forming a drive circuitry layer on a substrate, fabricating at least one fluid ejection element on a top portion of the substrate, grinding the substrate from a bottom portion of the substrate up to a predetermined height, etching the top portion of the substrate to configure at least one slot within the top portion of the substrate, depositing a layer of an etch-stop material over the top portion of the substrate while filling the at least one slot with the etch-stop material, etching the bottom portion of the substrate to configure at least one fluid feed trench within the bottom portion of the substrate, removing the layer of the etch-stop material from the top portion of the substrate, and laminating a flow feature layer and a nozzle plate as a single unit over the top portion of the substrate.

A packaging label for an inkjet printhead including a first label portion adapted for adhesion to a first surface of the inkjet printhead, and a second label portion adapted for adhesion to a second surface of the inkjet printhead. The second label portion has a forked configuration including a first outer portion, a second outer portion and a central portion disposed between the first and second outer portions and adapted for adhesion to a packaging tape adhered to a nozzle plate of the inkjet printhead. The adhesion between the second label portion and the second surface of the inkjet printhead is higher than the adhesion between the first label portion and the first surface of the inkjet printhead.

Label for inkjet printhead

A method for fabricating an ejection chip of a fluid ejection device includes forming a drive circuitry layer on a substrate, fabricating at least one fluid ejection element on the substrate, forming at least one slot within a top portion of the substrate, filling each slot of the at least one slot with a protective material, grinding the substrate from a bottom portion of the substrate up to a predetermined height, removing the protective material from the each slot of the at least one slot, and laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot.

Disclosed is a fluid ejection device for an inkjet printer that includes a substrate. The substrate includes at least one trench and a plurality of fluid flow vias configured in at least three parallel rows arranged over each trench of the at least one trench. Each row of the at least three parallel rows includes a set of fluid flow vias from the plurality of fluid flow vias arranged in one of a uniform manner and a non-uniform manner such that each fluid flow via of the set of fluid flow vias is configured in a spaced-apart relation with an adjacent fluid flow via. The each fluid flow via is configured in a diagonal relationship relative to a neighboring fluid flow via of an adjacent row of the at least three parallel rows. The fluid ejection device also includes a flow feature layer and a nozzle plate.

Fluid ejection devices

A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.

Modular micro-fluid ejection head assembly

A process for making a substantially planar micro-fluid ejection head is disclosed, and includes depositing a basic solution on a first surface of a device substrate. The first surface having the basic solution deposited thereon is contacted together with a surface of a support material for a duration ranging from about 1 minute to about 15 minutes, at a temperature ranging from about 20&#xb0; C. to about 90&#xb0; C. so that the first surface having the basic solution deposited thereon and the surface of the support material form a bond therebetween to hermetically seal the support material and the device substrate to one another. Both the substrate and the at least one surface of the support comprise silicon, and at least one of the device substrate and the at least one surface of the support material is substantially composed of silicon.

Method for making a substantially planar micro-fluid ejection head

Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.

Fluid ejection device and method for fabricating fluid ejection device

A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.

Micro-fluid ejection heads and methods for bonding substrates to supports

A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si&#x2014;O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.

Growing community of inventors

Lexington, KY, United States of America

Andrew McNees