Arris Composites Inc.

Andrew Mathews

Riley Reese

Ethan Escowitz

J Scott Perkins

Erick Matthew Davidson

Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compression molding. The electrical circuit is disposed in a composite ply, in a lay-up of composite plies, and electrical leads are routed through the composite plies so that the lead are accessible in the molded fiber-composite part.

Fiber composites comprising a circuit, and method therefor

A method for forming a composite part involves forming a layup comprising (a) preforms/flat form-factor feedstock, either of which includes a plurality of fibers and a matrix precursor, and (b) a differential-melt polymer. The matrix precursor and the differential-melt polymer differ as to at least one of thermal properties and rheological properties. The layup is subjected to controlled application of heat and pressure to melt the matrix precursor and differential-melt polymer. The polymers are then cooled to form a composite part that displays properties attributable to all the constituents. As a function of a variety of factors, the resulting part can be homogenous or heterogenous, and the properties can be localized or global throughout the part.

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Berkeley, CA, United States of America

Andrew Mathews