Littelfuse, Inc.

University College Cork

Andrew Mark Connell

John Barrett

Paul McCloskey

Sean Cian O'Mathuna

Terence O'Donnell

Stephen O'Reilly

Caroline Clinton

Magall Brunet

James F Rohan

Trevor R Spalding

An insulating layer () and a conductive seed layer () are applied to a substrate () in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer () is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.

Plating of multi-layer structures

A method of providing a semiconductor device with a selectively deposited inorganic electrically insulative layer, the device having exposed semiconductor surfaces and electrically conductive metal end terminations, in which the device is saturated in a phosphoric acid solution to form a phosphate layer on the exposed surfaces of the semiconductor but not on the metal end terminations. The device is thereafter plated by a conventional plating process and the plating is provided only on the end terminations.

Phosphate coating for varistor and method

Growing community of inventors

Cork, Ireland

Andrew Mark Connell