Alliedsignal Inc.

Allied Corporation

Andrew M Zweig

Joseph J Zupancic

James A Wrezel

Jean M Frechet

Jeffrey P Conrad

Donald Pickens

Daniel Franklin Harnish

Robert E Rinehart

Peter Julius Kartheiser

Jeffery P Conrad

Improved poly(vinyl chloride) compositions which exhibit improved adhesivity to polyamide which find particular utility in the construction of multi-layer structures, particularly for the fabrication of improved structures for use in forming electrical insulation structures for wires and cables. In one useful embodiment, the multi-layer structure has in the following order: a layer of PVC and a layer of polyamide in contact with the layer of PVC wherein the layer of PVC includes a vinyl chloride containing copolymer or a terpolymer which exhibits good solubility with the PVC, and which further provides good adhesivity with the PA. The vinyl resin is selected from the group consisting of vinyl chloride-vinyl acetate-vinyl alcohol terpolymers.

Poly(vinyl chloride) compositions exhibiting increased adhesivity to

A novel class of fluorinated surfactant monomers which when blended and cured with conventional non-fluorinated monomers produces resins with dramatically modified surfaces. Resins which may be thus modified include urethanes, epoxides, acrylates, polyesters and other thermosetting materials.

Fluorinated surfactant monomers for polymer surface modification

Oligomeric condensation products of certain diketones and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of diacetylbenzene with from 3.5 to 4.0 molar proportions of phenol and end-capped with from 50 to 100% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.

Ethers of oligomeric phenol-diketone condensation products and a

A difunctional epoxy acrylate monomer is prepared by reacting a highly fluorinated diglycidyl either with an excess of acrylic acid in the presence of a suitable catalyst. The acrylate has the following structure; ##STR1## where N is an integer from 1 to 30. This monomer is totally miscible with nonfluorinated polyacrylates. Clear, colorless, low refractive index polymers can be prepared by polymerization of this monomer or blends with other acrylates to give products useful as low surface energy coatings, and low refractive index coatings, on a wide range of substrates.

Fluorinated diacrylates

Thermosetting resins which are essentially vinylbenzyl end-capped ethers of the oligomeric condensation products of certain dihydric phenols and formaldehyde are readily polymerized to give an extensively cross-linked polymer particularly useful in printed circuit boards and similar laminates. Effective cost reduction may be enjoyed by replacing up to 50% of the vinylbenzyl moieties by other groups, such as alkyl and benzyl groups, without destroying the usefulness of the resulting thermosetting resins. The vinylbenzyl ether product from bisphenol-A is especially recommended.

Styrene terminated multifunctional oligomeric phenols as new

A method is presented to prepare totally functionalized ether-capped oligomeric polyphenols without molecular weight fractionation. The products generally are very low in inorganic salts and are characterized by the absence of volatiles leading to void formation in their subsequent curing. The success of the method rests upon conducting the reaction under totally homogeneous conditions throughout.

Complete ether capping of oligomeric polyphenols

The resins resulting from converting dicyclopentadiene-phenol adducts to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from therma, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.

Vinyl-benzyl ethers of phenol-dicyclopentadiene adducts as new

Oligomeric condensation products of certain dialdehydes and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of glyoxal with from 3 to 4 molar proportions of phenol and end-capped with from 50 to 85% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.

Ethers of oligomeric phenol-dialdehyde condensation products and a

Homogeneous thermosetting copolymers comprising a mixture of styrene-terminated tetrakisphenols and compounds containing at least one pendant vinyl group as exemplified by styrene-terminated tetrakisphenol ethane and styrene-terminated bisphenol A will possess desirable characteristics such as low dielectric constants and high glass transition temperatures. These polymers may be utilized as a component in laminates or circuit boards which are employed in relatively complicated pieces of electronic equipment.

Homogeneous thermosetting copolymers

Thermoset polymers of styrene terminated tetrakis phenols may be prepared from resins which possess the generic formula ##STR1## in which R is selected from the group consisting of alkyl, cycloalkyl, alkaryl and substituted alkaryl radicals and X is independently selected from the group consisting of hydrogen and halogen atoms. These polymers will be utilized as a component in laminates on circuit boards which are employed in relatively complicated pieces of electronic equipment.

Growing community of inventors

Schaumburg, IL, United States of America

Andrew M Zweig