Other

Macdermid, Incorporated

Macdermid Acumen, Inc.

Andrew M Krol

Ernest Long

Lev Taytsas

Steven A Castaldi

Robert M Hamilton

Peter E Kukanskis

Adam Letize

Robert Hamilton

A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Method for improving plating on non-conductive substrates

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, R, and Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts with NHand is diazotized followed by a polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Ris a carbon in the aromatic ring, Rand Rrepresent any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable as an additive in a metal plating bath comprising copper. The method includes the steps of a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced with a smaller quantity of unreacted monomer remaining in the end product than those produced using methods of the prior art.

Method of producing polymeric phenazonium compounds

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, Rand Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts as NHand is diazotized followed by polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Ris a carbon in the aromatic ring, and wherein R&#x2014;N&#x2014;Rrepresents a substituted amine, and Rand Rrepresent any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.

A process of making a polymeric phenazonium compound having the general formula: wherein R, R, R, R, R, Rand Rare the same or different, and represent hydrogen, a low alkyl or a substituted aryl, Rstarts with NHand is diazotized followed by polymerization, Rand Rmay alternatively represent monomeric or polymeric phenazonium radicals, Rwith its substituent group is a substituted amine, with Rand Rrepresenting any combination of CH, CH, and hydrogen, except that Rand Rcannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath. The method includes the steps of: a) dissolving an effective amount of an amino compound in a formic acid solution; b) adding a nitrite salt to diazotize the amino compound; and c) adding sulfamic acid to neutralize any excess nitrous acid that may be formed in step b), whereby a polymeric phenazonium compound is produced.

A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) applying a UV etch resist to the treated anti-reflective surface, and c) exposing the anti-reflective surface to a wet chemical etchant composition to remove exposed areas of the anti-reflective surface. Thereafter, the substrate can be metallized to provide a conductor pattern. The method may be used to produce silicon solar cells.

Surface treatment of silicon

A process is disclosed for plating upon a polymeric surface with improved adhesion and coverage. The process comprises plating a metallic deposit upon a polymeric surface which has not been completely polymerized and then further curing the plated upon surface.

Growing community of inventors

Bristol, CT, United States of America

Andrew M Krol