International Business Machines Corporation

Andrew Lu

Timothy Joseph Dalton

Christopher Vincent Jahnes

Kevin Shawn Petrarca

Richard Paul Volant

George Frederick Walker

Chandrasekhar Narayan

Tien-Jen Cheng

Helen Wang

Patricia Argandona

David K Anderson

Faisal Azam

Conal Eugene Murray

Matthew S Angyal

Habib Hichri

Dale Curtis McHerron

Karen Lynne Holloway

Roger J Yerdon

Giovanni Fiorenza

Qiang Wu

Juan A Chediak

Donald M Odiwo

Method for measuring misalignment between at least two layers of an integrated circuit. The method includes applying a current between a plurality of probe members in a first layer, wherein a first probe member and a second probe member of the plurality of probe members are substantially aligned along a first axis and partially overlap an overlay target in a second layer, measuring a voltage across the plurality of probe members wherein at least a voltage across the first probe member and a third probe member disposed perpendicular to the first axis and a voltage across the second probe member and the third probe member are measured, and determining an amount of misalignment between the first layer and the second layer along at least one of the first axis and the second axis based on the measuring steps.

Systems and methods for overlay shift determination

A system, a method and a computer program product for analyzing a circuit design provide for discretizing the circuit design into a series of pixels. A fraction of at least one constituent material is determined for each pixel. A deflection is also determined for each pixel. The deflection is predicated upon a planarizing of the pixel, and it is calculated while utilizing an algorithm that includes the fraction of the at least one constituent material. A series of deflections for the series of pixels may be mapped and evaluated.

Deflection analysis system and method for circuit design

The systems and methods enable the determination of the magnitude and direction of overlay of at least two elements in two layers. Overlay measurements along two axes can be obtained using four probe pads and without requiring a decoder. Overlay measurements along a single axis can be obtained using three probe pads and without requiring a decoder. The systems and methods according to this invention require less space and are more time efficient than conventional measurement structures. In the systems and methods of this invention, offsets in a direction are calculated from resistance measurements.

A method and structure for a fuse structure comprises an insulator layer, a plurality of fuse electrodes extending through the insulator layer to an underlying wiring layer, an electroplated fuse element connected to the electrodes, and an interface wall. The fuse element is positioned external to the insulator, with a gap juxtaposed between the insulator and the fuse element. The interface wall further comprises a first side wall, a second side wall, and an inner wall, wherein the inner wall is disposed within the gap. The fuse electrodes are diametrically opposed to one another, and the fuse element is perpendicularly disposed above the fuse electrodes. The fuse element is either electroplatted, electroless plated, or is an ultra thin fuse.

Fuse structure and method to form the same

A method of repeatedly exposing a pattern across a wafer in a sequential stepping process is disclosed. The pattern that is exposed includes at least one alignment mark. Each time the exposing process is repeated, the current exposure overlaps a portion of the wafer where the pattern was previously exposed and thereby erases a previously exposed alignment mark by re-exposing an area of the wafer where the previously exposed alignment mark was located. After the exposing process is repeated across the wafer, alignment marks remain only in the last exposed areas of the wafer.

Method for printing marks on the edges of wafers

An alignment mark structure for use upon a semiconductor substrate is disclosed. In an exemplary embodiment, the alignment mark structure includes a plurality of segments arranged in an alignment pattern, with each of the plurality of segments being formed from a base pattern created on the substrate. The base pattern includes a plurality of sizes, wherein each of the plurality of sizes of the base pattern is repeated throughout an entire length of each of the plurality of segments.

Process-robust alignment mark structure for semiconductor wafers

A method of forming a dual damascene pattern in a dielectric, includes etching a pattern of lines minus vias overlapping the lines to a line depth, leaving the dielectric unetched at the via locations; while the vias are etched in a separate step, starting from the top surface of the dielectric and continuing to a via depth greater than the line depth.

Via masked line first dual damascene

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Poughkeepsie, NY, United States of America

Andrew Lu