Hewlett-packard Development Company, L.p.

Andrew L Wiltzius

Robert Lee Crane

Tom J Searby

Adolfo Adolfo Gomez

Jonathan Shea Robinson

Robert Paul Martin

Bruce E Blaho

River Yao

Robert J Ebner

Julie Duke

Heather Burnam Volesky

Mark J Wierbilis

In an example implementation, a computer assembly includes a computer enclosure, a motherboard with an inset edge section that forms a motherboard air gap between the motherboard and a rear wall of the enclosure when the motherboard is installed in the enclosure, a vent opening formed in the enclosure below the motherboard, and an air mover to draw air from above the motherboard, through the air gap, and below the motherboard, and to expel the air drawn below the motherboard from the enclosure through the vent opening.

Expelling air from a computer enclosure

In an example implementation, an expansion card assembly includes a low-profile expansion card, a card cooler attached to the card to force air over the card, and an airflow guide attachable to the card to direct forced air from the card cooler out of a full-height computer enclosure.

Expansion card assembly

A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.

Printed circuit board component cover

An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

Shell ductings for cool air delivery

A heat sink module has a leg for tool-less engagement with a mounting structure on a circuit board. Engagement of the heat sink module with the mounting structure is to cause thermal contact between the heat sink module and a heat generating device.

Mounting a heat sink module

Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Removable airflow guide assembly with a processor air cooler and memory bank coolers

A method and system of controlling computer system external effects. At least some of the illustrative embodiments may be a computer system comprising a processor (wherein a computer system user interacting with software executed on the processor triggers a software event), and an external effects controller coupled to the processor (wherein the external effects controller controls at least one device being a purely aesthetic device or a non-aesthetic device operated in a manner for aesthetic reasons). The computer system user selectively associates the at least one device to the software event such that, if associated, upon occurrence of the software event an operational state of the at least one device is changed by the external effects controller.

Method and system of controlling computer system external effects for a computer game, the external effects such as incandescent lights, fluorescent lights, vibration devices, LED/laser diodes, and/or fans

A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.

Growing community of inventors

Fort Collins, CO, United States of America

Andrew L Wiltzius