Molex Corporation

Andrew Kolak

Wenzong Chen

Thomas R Marrapode

Sung-Ping Huang

Jesus Enrique Fung

Chih Chung Wu

Sheng-Pin Su

Chien-Lang Tai

Scott D Sommers

Li Zhuang

Dominic Steier

Kirk B Peloza

Hazelton P Avery

Ayman Isaac

Vivek Shah

Pu Xie

Chia Hung Mou

Jerry Shubert

Daniel Wenzel

Matt Cox

Dan Wenzel

High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance. In one example, a connector assembly, comprising: a housing comprising a port; a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.

Shielded connector assemblies with temperature and alignment controls

Connector pair

Examples of connectors, connector assemblies, and wafer assemblies for improved shielding and thermal performance are described. In one example, a wafer assembly includes a ground path assembly and a row of conductors. The ground path assembly includes a first ground shield and a second ground shield. The row of conductors includes a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors. The first ground shield extends along a first pair of communication signal conductors among the plurality of communication signal conductors and the second ground shield extends along a second pair of the communication signal conductors among the plurality of communication signal conductors.

Connector housing

A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.

Connector with shielded terminals

Connector

Input/output (I/O) connectors () for conducting data at high data rates, (e.g. 112 gigabits per second or more) are provided with protective shields () to provide increased mechanical strength and signal integrity.

Various examples of high speed connectors and connector assemblies that use connector side plate designs and include structures for improved thermal performance are described. In one example, a connector assembly includes a housing, a side plate on one side of the housing, and a wafer assembly that includes a row of conductors and a protrusion, with the protrusion being located at one end of the row of conductors. The side plate can include an aperture, and the protrusion can be inserted into the aperture to align the row of conductors.

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Villa Park, IL, United States of America

Andrew Kolak