Raytheon Company

Gritters, Darin M.

Brown, Andrew K.

Andrew Kent Brown

Kenneth William Brown

Darin M Gritters

Michael John Sotelo

William Earl Dolash

Thomas Lee Obert

Andrew Gamalski

Travis B Feenstra

Brandon William Pillans

James Stephen Mason

Michael A Moore

Reid F Lowell

Patrick J Kocurek

Thomas A Hanft

Miroslav Micovic

Philip D Starbuck

Domingo Cruz-Pagan

Shane A O'Connor

Darren Himbaza

George G Jones

Thanh C Ta

James E Gallivan

Andrew David Gamalski

Andrew D Gamalski

William E Dolash

Kenneth Brown

An apparatus includes multiple patch antenna elements configured to transmit multiple electromagnetic beams in multiple beam directions. The apparatus also includes multiple inputs each configured to receive one of multiple input signals, where each input signal is associated with one of the electromagnetic beams. The apparatus further includes multiple phase-tapered splitters each configured to receive one of the input signals, divide the received input signal into a set of sub-signals, and provide a phase taper that adjusts phases of at least some of the sub-signals in the set of sub-signals. Different phase tapers are associated with different ones of the beam directions. In addition, the apparatus includes multiple 90° hybrid transformers each configured to receive sub-signals associated with different ones of the input signals, isolate the received sub-signals from each other, and provide the isolated sub-signals to one of the patch antenna elements.

Multi-beam passively-switched patch antenna array

A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.

Low cost panel AESA with thermal management

A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.

Modular electronically scanned array (ESA)

A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.

Modular spatially combined EHF power amplifier

A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (&#x3bb;), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=&#xbc;&#x3bb;, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion.

Line isolation of radio frequency devices

An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.

Radiofrequency absorptive filter

Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.

High frequency, high bandwidth, low loss microstrip to waveguide transition

A transition for coupling a microwave signal between a transmission line formed on a planar dielectric substrate and a hollow waveguide may include a half-notch antenna formed on a portion of the dielectric substrate extending into an open end of the hollow waveguide.

Low loss broadband planar transmission line to waveguide transition

A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.

Lens array module

Modular MMW power source

A modular solid-state MMW power source based on a topology of the lens array amplifier provides both the flexibility to scale output power and effective thermal management. The modular power source includes a single submodule that uses one or more power dividers and one or more solid-state amplification stages to divide and amplify an RF input signal into R amplified RF signals. The submodule is mounted (suitably in the X-Y plane) on the surface of a heat sink, suitably coupled to a cold backplane, to remove heat. R 1:N low loss power dividers route the amplified RF signals to R*N radiating elements. Each of the 1:N power dividers suitably reside in the X-Z plane and are stacked in the Y direction to provide a planar output of the R*N radiating elements in the Y-Z plane. Placement of the amplifier chips on the single submodule decouples the number of amplifier chips, hence output power, from the number of radiating elements. Placement of the amplifier chips away from the radiating face provides a short path with large thermal cross-section through the heat sink to the backplane to remove heat. The topology can produce high output power combined with a high antenna gain to produce large power-aperture products previously only achievable with a Gyrotron. As amplifier chips become more powerful, the topology can be adapted to use fewer chips.

Modular solid-state millimeter wave (MMW) RF power source

Embodiments of a high-frequency millimeter-wave amplifier are generally described herein. The high-frequency millimeter-wave amplifier may be constructed on a substrate to operate at a frequency of at least 75 GHz. In some embodiments, the millimeter-wave amplifier may include at least first, second, third and fourth amplifier stages coupled in series. A single drain bias bond pad provided on the substrate to provide a drain bias voltage to the drains of the first, second, third and fourth amplifier stages. Drain bias lines may be electrically coupled to the single drain bias bond pad and extend at least partially alongside and between some of the amplifier stages. A signal path through the second amplifier stage extends in a direction opposite of signal paths through the first and third amplifier stages. In some embodiments, a 95 GHz amplifier is provided and configured occupy an area on the substrate of no greater than approximately four square millimeters.

Millimeter-wave monolithic integrated circuit amplifier with opposite direction signal paths and method for amplifying millimeter-wave signals

There is disclosed an amplifier module which may include a plurality of N circuit devices, each of which may have at least two stages of amplification. Each circuit device may additionally have a DC input power terminal, a DC power return terminal, and at least one bias voltage terminal. The DC power terminals of the N circuit devices may be connected in series. A bias voltage network may have at least N taps, and each of the N taps may be connected to a bias voltage terminal of a corresponding one of the N circuit devices.

DC series-fed amplifier array

A description is provided of a high-frequency, multi-stage, millimeter wave amplifier integrated circuit, and of a method for designing and constructing the circuit. The methods and structures have been created to enable the construction of an amplifier offering substantial gain at a relatively high power and high frequency, but occupying minimal area of an integrated circuit die. Various structures and methodologies are described which each contribute to the practical feasibility of constructing an amplifier with such performance in a relatively compact space.

Millimeter wave monolithic integrated circuits and methods of forming such integrated circuits

A millimeter wave amplifier constructed on a substrate and configured for use at a frequency of 75 GHz or higher, may include four amplifier stages. A first inter-stage filter, resonant at an operating frequency of the amplifier, may couple the output of the first stage to the input of the second stage. A second inter-stage filter, resonant at the operating frequency, may couple the output of the second stage to the input of the third stage. A third inter-stage filter, resonant at the operating frequency, may couple the output of the third stage to the input of the fourth stage. A plurality of bias supply leads that couple a gate bias voltage and a drain bias voltage to each of the amplifier stages. A plurality of bias line filters, resonant at the operating frequency, may be connected from at least some of the bias supply leads to a ground plane.

Growing community of inventors

Victorville, CA, United States of America

Andrew Kent Brown