Leica Microsystems Cms Gmbh

Andrew K Lee

Falk Schlaudraff

Florian Hoffmann

A method for performing a laser microdissection for cutting a dissectate from a specimen using a laser includes the step of providing the specimen in a light path of an illumination system. The specimen is illuminated by the illumination system. A detector detects light emanating from the specimen. The light detected by the detector is analyzed. It is determined, based on the analysis of the light detected by the detector, whether a receptacle for collecting the dissectate is disposed in a predetermined collection position, at which the dissectate is to be collected in the receptacle after it is cut from the specimen. Laser cutting of the dissectate from the specimen is initiated based on it having been determined that the receptacle is in the predetermined collection position.

Laser microdissection method and laser microdissection systems

A method for laser microdissection includes detecting at least a portion of an object to be dissected in an image-producing manner in a laser microdissection system and generating a first digital object image. A first processing specification is defined based on the first digital object image. In a first processing step, the object is processed using a laser beam of the laser microdissection system in accordance with the first processing specification. At least a portion of the object is detected in an image-producing manner and a second digital object image is generated. A second processing specification is defined during execution of the first processing step based on the second digital object image. In a second processing step, the object is processed using the laser beam of the laser microdissection system in accordance with the second processing specification.

Growing community of inventors

Allen, TX, United States of America

Andrew K Lee