Intel Corporation

Other

Applied Materials, Inc.

Nanoport Technologies

Andrew Julius Muray

Satish R Menon

Robin Lynn Teitzel

Richard L Lozes

Allen M Carroll

Kathleen Muray

A high brightness LED () is precisely controlled. The temperature of the LED () is controlled via controlled thermal resistance (), measurement of the base temperature () and careful power monitoring of the LED ().

Stabilized high brightness LED suitable as calibration standard

Disclosed are methods for producing optical filters on a substrate. In particular, methods for producing microengineered optical filters for the ultraviolet/visible/infrared portions of the electromagnetic spectrum are disclosed, as well as a computer-based system and method for precisely matching predefined target transmission spectra using various coating materials whose spectra can be combined and weighted for the matching. In addition, methods for producing printed optical filters comprising multiple coating components to produce composite optical filters whose transmission spectra match predefined target filter spectrum specifications are disclosed, where the thickness and fill factor of each component coating is tailored, based on the weighting of each component coating transmission spectrum.

Microengineered optical filters that closely match predefined transmission curves and systems and methods of manufacture

A method for creating a large functional software component. The method includes the steps of building a large functional unit in a data/data presentation format and wrapping the large functional unit with an encapsulating program, creating a wrapped large functional unit. The method further includes the step of modifying the wrapped large functional unit to become operable with the encapsulating program.

Document/view application development architecture applied to ActiveX technology for web based application delivery

Dose conservation is used during pattern modification in the data preparation phase of scanning beam lithography. The features to be exposed on a substrate, such as a mask or direct written semiconductor wafer, are corrected while neighboring features suffer little or no change. Thus, the edge of a feature is moved in terms of its exposure location without appreciably affecting the scattering into its neighbors. This achieves a developed feature which meets the intended design edge location. This process also corrects for variations in resist profile angles which otherwise may vary depending upon localized feature packing density. Not only is the feature edge moved but its dose per area is adjusted while conserving total dose over the feature.

Growing community of inventors

Portland, OR, United States of America

Andrew Julius Muray