Rigetti & Co, LLC

Andrew Joseph Bestwick

Chad Tyler Rigetti

Mehrnoosh Vahidpour

Jayss Daniel Marshall

William Austin O'Brien, Iv

James Russell Renzas

Nagesh K Vodrahalli

Biswajit Sur

Chih-Yang Li

Cat-Vu Huu Bui

Keith Matthew Jackson

In a general aspect, an integrated quantum circuit includes a first substrate and a second substrate. The first substrate includes a first surface and a recess formed in the first substrate along the first surface. The recess has a recess surface and is configured to enclose a quantum circuit element. The first substrate includes a first electrically-conductive layer disposed on the first surface and covering at least a portion of the recess surface. The first electrically-conductive layer includes a first superconducting material. The second substrate includes a second surface and a quantum circuit element. The second substrate includes a second electrically-conductive layer on the second surface that includes a second superconducting material. The first substrate is adjacent the second substrate to enclose the quantum circuit device within the recess. The first electrically-conductive layer of the first substrate is electrically-coupled to the second electrically-coupled layer of the second substrate.

Microwave integrated quantum circuits with cap wafers and their methods of manufacture

In a general aspect, a superconducting via for routing electrical signals through a substrate includes the substrate and a layer formed of superconducting material. The substrate has a first orifice disposed on a first surface and a second orifice disposed on a second surface. A cavity extends through the substrate from the first orifice to the second orifice. The layer of superconducting material includes a first portion occluding the first orifice and having an exterior surface facing outward from the substrate. The layer also includes a second portion in contact with a side wall of the cavity and extending to the second orifice. A quantum circuit element may optionally be disposed on the first surface and electrically coupled to the exterior surface of the first portion of the layer.

Superconducting vias for routing electrical signals through substrates and their methods of manufacture

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Berkeley, CA, United States of America

Andrew Joseph Bestwick