Medtronic, Inc.

Kyocera Corporation

Andrew Jason Thom

Brad Conrad Tischendorf

Gordon Orvis Munns

Joyce Yamamoto

Markus W Reiterer

Darren A Janzig

Thomas P Miltich

Rajesh V Iyer

Gerald G Lindner

Christian S Nielsen

Hiroshi Makino

Hidekazu Otomaru

Kengo Morioka

Arne Knudsen

Shingo Satou

Andrew J Ries

Randy S Roles

Chris J Paidosh

Keiichi Fujii

John E Kast

Kunal J Paralikar

James D Reinke

John Louis Sommer

Gregory John Haubrich

John Daniel Norton

Kenneth C Gardeski

Steven T Deininger

Bernard Q Li

William John Taylor

Reginald D Robinson

Joseph M D'Sa

Erik R Scott

Mark D Breyen

Larry Earl Tyler

Nicholas R Whitehead

William Michael Brosnan

Simon E Goldman

David B Engmark

Greg Haubrich

Lea A Nygren

Jeffrey O York

David D Differding

Christopher J Paidosh

James A Johnson

Paul B Young

Susan A Tettemer

Takahito Hirata

George C Johnstone

William M Brosnan

Willam D Wolf

In some examples a medical device includes circuitry configured to at least one of sense a physiological parameter of a patient or deliver a therapy to the patient. The medical device may also include a housing configured to house the circuitry, wherein the housing includes a plurality of structural members and an attachment mechanism that joins the plurality of structural members. The attachment mechanism may be configured to suppress induced currents in the housing when the medical device is exposed to a time-varying magnetic field.

Ceramic enclosure for rechargeable medical devices

Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

Sealed package and method of forming same

Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

Implantable medical devices having modular lead bores

A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.

Diffusion bonded lead connector

A feedthrough assembly includes: a ferrule; an insulating structure; and a seal fixedly securing the insulating structure within the ferrule, the seal comprising a glass and single-phase particulate dispersed therein; wherein the glass includes: 25% to 40% BO; 0 to 25% CaO; 0 to 25% MgO; 0 to 25% SrO; 0 to 10% LaO; 5% to 15% SiO; and 10% to 20% AlO; wherein all percentages are mole percentages of the glass.

Feedthrough assembly

Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

A lead connector assembly includes a lead receptacle, a sleeve, and a handle for coupling to a medical lead. The lead receptacle has an inner surface and an opening configured to receive the lead. The sleeve is deflectable by the inner surface of the lead receptacle. The sleeve has a distal end portion defining a first outer diameter to engage the lead in a locked position and a second outer diameter greater than the first diameter in an unlocked position. The handle is coupled to the lead receptacle and a proximal end portion of the sleeve to move the sleeve axially in both directions along the longitudinal axis relative to the lead receptacle. The lead connector assembly retains the lead in the locked position. The lead receptacle is couplable to a medical device housing.

Toolless lead connector assembly

An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element. The light transmissive ring element forms an exterior segment of the distal end portion. The light transmissive ring element defines at least a portion of a hermetic cavity.

Implantable device with optical lead

Method of forming a sealed package

A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.

Hermetic feedthrough for an implantable medical device

An implantable active medical device includes a housing defining a hermetic cavity, a lead connector receptacle extending into the implantable active medical device, and a solid state light source disposed within the hermetic cavity and optically coupled to the lead connector receptacle.

Implantable device with optical lead connector

Growing community of inventors

Maple Grove, MN, United States of America

Andrew Jason Thom