Advanced Cooling Technologies, Inc.

Andrew J Slippey

William G Anderson

Jens E Weyant

Michael C Ellis

Calin Tarau

Michael Dechristopher

A heat pipe device comprising at least two of the following: an axially grooved bore for thermal transport, the axially grooved bore having an axial groove wick; a phase change material bore for thermal storage, the phase change material bore having internal fins to enhance heat transfer, the internal fins extend along the axis of the phase change material bore; and a porous media bore for accepting high heat fluxes, the porous media bore having a porous media wick in areas of high heat flux.

Multi-bore constant conductance heat pipe for high heat flux and thermal storage

An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.

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Grove City, PA, United States of America

Andrew J Slippey