The Charles Stark Draper Laboratory, Inc.

Andrew J Mueller

Jeffrey C Thompson

Thomas A Langdo

Livia M Racz

Gary B Tepolt

Maurice S Karpman

Nicole S Mueller

Michael Rickley

Charles Baab

An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one embodiment, the electronics module assembly can include a cavity wafer having a single frontside cavity that extends over a majority of a frontside surface area of the cavity wafer and a plurality of fillports. The assembly can also include at least one group of dies placed in the frontside cavity and encapsulant that secures the position of the at least one group of dies relative to the cavity wafer. Further, a layer of the encapsulant can cover a backside of the cavity wafer.

Method and apparatus for using universal cavity wafer in wafer level packaging

Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Electronic modules

Electronic modules and methods for forming the same

In accordance with a method for forming an interposer, a fill hole is formed in a first side of a substrate and a cavity is formed in a second side. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity, and an encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts. In accordance with a method of thermal management, an electronic component and a heat sink are disposed on opposing sides of an interposer that includes a plurality of encapsulated posts.

Interposers, electronic modules, and methods for forming the same

Growing community of inventors

Medford, MA, United States of America

Andrew J Mueller