International Business Machines Corporation

Globalfoundries Inc.

Depuy Synthes Products, Inc.

Depuy Ireland Unlimited Co.

Depuy (ireland)

Depuy Products, Inc.

Andrew J Martin

Melissa Alyson Smith

Bryan J Smith

Jeffrey A Rybolt

Kathryn E Schlichting

Vincent James McGahay

Jonathan R Fry

Hengda D Liu

Christopher F Klabes

Terence Lawrence Kane

Daren Lloyd Deffenbaugh

Anthony D Zannis

Taryn J Davis

Oleg Gluschenkov

Mukta G Farooq

Joyeeta Nag

Stephanie M Wainscott

Jin Ping Liu

William Francis Landers

Jennifer A Oakley

Derek Hengda Liu

Stephanie M Deruntz

Jeffrey A Rrybolt

A joint prosthesis system is suitable for cementless fixation. The system includes a metal implant component that has a mounting surface for supporting an insert. The metal implant component includes a solid metal portion and a porous metal portion. The porous metal portion has surfaces with different characteristics, such as roughness, to improve bone fixation, ease removal of the implant component in a revision surgery, reduce soft tissue irritation, improve the strength of a sintered bond between the solid and porous metal portions, or reduce or eliminate the possibility of blood traveling through the porous metal portion into the joint space. A method of making the joint prosthesis is also disclosed. The invention may also be applied to discrete porous metal implant components, such as augment.

Prosthesis with surfaces having different textures and method of making the prosthesis

A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

Time temperature monitoring system

A joint prosthesis system is suitable for cementless fixation. The system has two metal implant components and a bearing. One of the metal implant components has an articulation surface for articulation with the bearing. The other metal implant component has a mounting surface for supporting the bearing. One of the metal implant components includes a solid metal portion and a porous metal portion. The porous metal portion has surfaces with different characteristics, such as roughness, to improve bone fixation, ease removal of the implant component in a revision surgery, reduce soft tissue irritation, improve the strength of a sintered bond between the solid and porous metal portions, or reduce or eliminate the possibility of blood traveling through the porous metal portion into the joint space. A method of making the joint prosthesis is also disclosed. The invention may also be applied to discrete porous metal implant components, such as augment.

A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

Approaches for detecting wear in integrated circuit chips are provided. An on-chip sensor system includes an integrated circuit chip including a plurality of sensor groups. Each respective one of the sensor groups is structured and arranged to detect a measure of wear corresponding to a respective one of a plurality of failure mechanisms.

Electrical circuit odometer sensor array

Disclosed is a process of annealing through silicon vias (TSVs) or other deeply buried metallic interconnects using a back side laser annealing process. The process provides several advantages including sufficient grain growth and strain relief of the metal such that subsequent thermal processes do not cause further grain growth; shorter anneal times thereby reducing cycle time of 3D device fabrication; and reduced pattern sensitivity of laser absorption.

Laser anneal of buried metallic interconnects including through silicon vias

A method of forming through silicon vias (TSVs) on integrated circuit (IC) chips and the IC chips. A TSV pattern on a stack of wiring layers on the surface of the IC chip identifies TSV locations. Etching the IC chip TSV pattern opens a cup shaped through hole through the stack to the silicon substrate at each TSV pattern location. The etched stack forms a TSV hard mask open (HMO) for the silicon substrate. Via through holes etched through the silicon substrate masked by the HMO are filled with conductor connecting IC circuits, e.g., to signal lines on the bottom of the chip.

Integrated circuit (IC) chips with through silicon vias (TSV) and method of forming the IC

A three-dimensional organic structure or glass interposer structure and methods of manufacture are disclosed. The method includes forming lined metal vias in a substrate. The method further includes removing the substrate, leaving the lined metal vias. The method further includes forming a new substrate about the lined metal vias. The method also includes connecting the lined metal vias to wiring layers using back end of the line processes.

Three dimensional organic or glass interposer

Provided are methods for processing a green body that includes compacted metal powder, comprising impacting the green body with a particulate material for a time and under conditions effective to displace a portion of the metal powder from the green body. The present methods can be used to prepare green bodies that have 'roughened' surfaces and that can be used to make orthopedic implants displaying low movement relative to bone when installed in situ, which corresponds to higher stability upon implantation and decreases the time required for biological fixation of the implant. Also provided are implants comprising a metallic matrix, and methods comprising surgically installing an implant prepared from a 'surface roughened' green body in accordance with the present invention.

Implants with roughened surfaces

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Carmel, NY, United States of America

Andrew J Martin