Intel Corporation

Siros Technologies, Inc.

Emcore Corporation

Neophotonics Corporation

Other

Andrew J Daiber

Dmitri E Nikonov

Mark E McDonald

William B Chapman

Hua Li

Lambertus Hesselink

Robert R McLeod

Sergei L Sochava

Marc A Finot

Yinan Wu

John F Heanue

William J Kozlovsky

Jiann-Chang Lo

Shengbo Xu

Alejandro Dario Farinas

Mark Rice

Nadim I Maluf

Michael V Morelli

Kevin A Sawyer

Tokuyuki Honda

Ray Snyder

Boyang Liu

Sanjoy Ghose

Shunichi Nishimura

Jiro Yoshinari

Hideki Hirata

Takuya Tsukagoshi

Naoki Hayashida

Anand S Ramalingam

Xiaoguang He

Douglas A Sprock

Herman Ferrier

Frank Lei Ding

Matthew Lipson

Ingolf Sander

Carter F Hand

Thomas Kridl

LeRoy A Volz

Timothy M Slagle

Paul Chi-Hwa Lin

James R Amble

Doug Sprock

Rob Carney

Tokyuki Honda

Lambrerrtus Hesselink

James Colvin

Paul Ludwig

Hendrikus Bukkems

Robert Agar Carney

Mark E Mcdonald

John M Hutchinson

A tunable laser configured in a small package subassembly including a gain chip positioned in the interior space between first and second tunable filter subassemblies. The tunable laser is packaged in either a rectangular or cylindrical housing, with an electrical input interface positioned at one end of the housing.

Semiconductor tunable laser package with tunable optical filters subassembly

Wafer level focus lens assembly

A tunable laser transmitter configured in a small package subassembly coupled to a printed circuit board such as an ITLA assembly. The tunable laser transmitter includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing. An optical output interface is positioned at the second end of the housing and configured to transmit a modulated optical beam.

Small packaged tunable laser transmitter

A tunable laser transmitter configured in a small package subassembly coupled to a printed circuit board. The tunable laser transmitter includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing. A first and a second optical output interface is positioned at the second end of the housing, the first output being configured to transmit a modulated optical beam, and the second output configured to transmit a cw beam to the local oscillator of an external receiver.

Support for a beam splitter

A tunable laser configured in a small package coupled to a printed circuit board. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A semiconductor optical amplifier or gain chip produces an optical output beam, and an optical isolator is positioned directly downstream of the gain chip to prevent the incoming light from the downstream optics from reflecting back though the isolator and into the cavity of the laser. A beam splitter directs a portion of the light transmitted through the isolator back into the other end of the gain chip.

Small packaged tunable traveling wave laser assembly

A tunable laser configured in a small package coupled to a printed circuit board. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A beam splitter and photodiode is disposed in the path of the laser beam for determining the emitted intensity of the laser beam, and an optical isolator is positioned downstream of the beam splitter to prevent the incoming light from the beam splitter from reflecting back though the beam splitter and into the cavity of the laser.

Small packaged tunable laser assembly

A method comprising forming two or more frames from a first wafer, forming two or more etalons from a second wafer, disposing a resistive thermal device on each of the two or more frames, dicing the first wafer and the second wafer, and bonding each of the frames to a corresponding one of the etalons to form optical subassemblies of optical filters.

Thermal control of optical filter with local silicon frame

According to one embodiment, the present application includes a tunable laser configured in a small package. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing and configured to receive an information-containing electrical signal. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A tunable semiconductor laser is positioned in the interior space and operable to emit a laser beam having a selectable wavelength. A focusing lens assembly is positioned in the interior space along an optical path of the laser beam to operatively couple the laser beam to the optical output interface.

Small packaged tunable laser with beam splitter

A method comprising generating an optical beam with a laser, filtering the optical beam to select a desired wavelength with an etalon positioned in a path of the optical beam, heating the etalon to an operational temperature using a heater, monitoring the operational temperature of the etalon with a resistive thermal device disposed in or on a thermally conductive frame bonded to the etalon, and applying feedback control of the heater based on the monitoring to select the desired wavelength.

Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.

Tunable Laser Assembly

A chip carrier having improver thermal properties, wherein the chip carrier may be formed having waist section, and a first transverse end portion joined to the waist section. A first surface of the carrier being configured to receive a chip thereon, and a second surface of the carrier configured to be coupled to a thermal control unit to provide cooling of the carrier and chip. The chip carrier may have a second transverse end portion joined to the waist portion in certain embodiments.

Chip carrier apparatus and method

Laser assembly

Growing community of inventors

Palo Alto, CA, United States of America

Andrew J Daiber