Olin Corporation

Swiss Aluminium Ltd.

Swiss Aluminum Ltd.

Andrew J Brock

William H Anthony

James M Popplewell

Deepak Mahulikar

Satish K Jalota

Michael J Pryor

Frank N Mandigo

Damian V Gullotti

Arvind Parthasarathi

Anthony M Pasqualoni

Dexin Liang

German J Ramirez

Efraim Sagiv

Michael A Holmes

Jeffrey M Schlater

Constance F Acton

Eugene Shapiro

John F Breedis

Lifun Lin

Julius C Fister

Edward F Smith

Ronald N Caron

Paul Menkin

Ned W Polan

David D McDevitt

Jack Crane

Murray A Heine

Mark N Pearman

There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Anodized aluminum substrate having increased breakdown voltage

There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.

Corrosion-resistant bismuth brass

A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 80 amps per square foot and then allowed to gradually decrease as a function of oxide growth.

Anodized aluminum electronic package components

An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.

Surface topography optimization through control of chloride

A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 70 amps per square foot and then allowed to gradually decrease as a function of oxide growth while the voltage is maintained in excess of 70 volts.

Process for producing black integrally colored anodized aluminum

A process for etching copper or a copper base material with an aqueous solution consisting essentially of peroxydisulfuric acid, up to about 500 ppm of a halide addition and the balance water is described. The process includes off-line generation/regeneration of the etching solution. An electrochemical cell for generating/regenerating the etching solution is also described.

Process for etching copper base materials

A solution for etching copper or a copper base material, the solution consisting essentially of peroxydisulfuric acid, being present in an amount of from about 0.5N up to about 6.0N, with chloride or fluoride present in an amount of from about 10 ppm up to about 500 ppm, and the balance water is described.

Process and apparatus for etching copper base materials

The present invention relates to copper-silicon-tin alloys having improved cleanability. These alloys consist essentially of from about 1.0% to about 5.0% tin, from about 1.0% to about 4.5% silicon, an element selected from the group consisting of from about 0.05% to about 0.5% magnesium and from about 0.01% to about 0.5% lithium, and the balance essentially copper. The alloys may also contain from about 0.01% to about 0.45% chromium.

Copper-silicon-tin alloys having improved cleanability

The present invention relates to a cleaning solution for removing surface oxides from copper base alloys without significantly etching the copper-base alloy material. The cleaning solution comprises from about 1 v/o to about 50 v/o hydrofluoric acid and from about 5 v/o to about 50 v/o of at least one of sulfuric acid and hydrochloric acid. In a preferred embodiment, the cleaning solution consists essentially of from about 5 v/o to about 15 v/o hydrofluoric acid and from about 25 v/o to about 50 v/o sulfuric acid and the balance essentially water.

Copper-base alloy cleaning solution

A heat treatment for providing copper-tin alloys with a substantially continuous tin-phosphorous-oxide protective layer that improves the appearance and the tarnish resistance of the alloys is disclosed. The heat treatment comprises heating the alloys in a reducing atmosphere having a dew point of at least about 65.degree. F. and a temperature in the range of about 700.degree. C. to about 900.degree. C. for a time in the range of about 2 hours to about 24 hours.

Protective film on Cu-Sn alloys

Process for forming a protective film on Cu-Sn alloys

A rapid and effective surface cleaning process for copper alloys, particularly copper alloys containing aluminum and other metals tending to form surface coatings of refractory oxides during annealing treatments, consists of treating such alloys or articles fabricated thereof for a short time in a hot aqueous solution of an alkali hydroxide, rinsing with water, and then immersing for a short time in a hot aqueous solution of ferric sulfate, or other ferric salt of a mineral acid, followed by rinsing with water.

Copper alloy cleaning process

An alloy system is disclosed which is particularly useful for heat exchanger and potable water tubing applications. This alloy system utilizes additions of nickel, tin and manganese in a copper base with the optional addition of aluminum. Such elements as arsenic, antimony and phosphorus may be added as parting inhibitors to this system.

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Cheshire, CT, United States of America

Andrew J Brock