Arch Specialty Chemicals, Inc.

Ocg Microelectronic Materials, Inc.

Olin Hunt Specialty Products Inc.

Olin Microelectronic Chemicals, Inc.

Arch Chemicals, Inc.

Petrarch Systems

Petrarch System, Inc.

Andrew J Blakeney

Alfred T Jeffries, Iii

Sanjay Malik

Medhat A Toukhy

Lawrence Ferreira

Joseph J Sizensky

Sobhy Tadros

John Joseph Biafore

Patrick Foster

Kenji Honda

Ahmad A Naiini

Thomas R Sarubbi

Arturo N Medina

Sydney George Slater

William D Weber

Thomas Steinhausler

Brian E Maxwell

Gregory Domenic Spaziano

Steve L Hsu

Thomas Steinh&auml;usler

Binod B De

James M Lewis

David J Brzozowy

Sidney George Slater

J Thomas Kocab

John P Hatfield

Daniela White

Ognian N Dimov

Steve Lien-Chung Hsu

Pamela J Waterson

Stephanie J Dilocker

Robert A Owens

Robert F Rogler

Jacqueline Marie Marshall

Allen H Gabor

Lawerence Ferreira

John Ferri

Jeffery Eisele

Gail McCormick

Medhat A Touky

Thomas Steinhäusler

Ulrich Schaedeli

The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

Hydroxy-amino thermally cured undercoat for 193 nm lithography

Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula:wherein Ris H or methyl; Ris a substituted or unsubstituted C-Caryl acrylate or C-Caryl methacrylate group wherein the substituted groups may be phenyl, Calkyl or Calkoxy; Ris a hydroxyl functionalized C-Calkyl acrylate, methacrylate or C-Caryl group, Ris a C-Clinear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the [&#x2014;RO&#x2014;]; Ris a C-Clinear, branched or cyclic alkyl, substituted or unsubstituted C-Caryl, or substituted or unsubstituted C-Calicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

Thermally cured underlayer for lithographic application

Radiation sensitive compositions for use in producing a patterned image on a substrate comprise:

Photoresist compositions

A photoacid compound having the following general structure:R&#x2014;O(CF)SOXwherein n is an integer between about 1 to 4; R is selected from the group consisting of: substituted or unsubstituted C-Clinear or branched alkyl or alkenyl, substituted or unsubstituted araalkyl, substituted or unsubstituted aryl, substituted or unsubstituted bicycloalkyl, substituted or unsubstituted tricycloalkyl, hydrogen, alkyl sulfonic acid, substituted or unsubstituted perfluoroalkyl, the general structure F((CF)O)(CF)&#x2014; wherein p is between about 1 to 4, m is between about 0 to 3 and q is between about 1 to 4, and substituted or unsubstituted partially fluorinated alkyl, halofluoroalkyl, perfluoroalkylsulfonic, or glycidyl; and X is selected from the group consisting of: organic cations and covalently bonded organic radicals.

Photoacid generators for use in photoresist compositions

Hydroxy-amino thermally cured undercoat of 193 nm lithography

A photoresist composition comprising at least one acetal polymer having a silicon substituent; provided that the silicon substituent is not directly attached to the acetal functionality, thereby providing high resolution, improved DOF, and improved dimensional stability under metrology conditions.

Silicon-containing acetal protected polymers and photoresists compositions thereof

Radiation sensitive compositions containing image quality and profile enhancement additives

The present invention is directed to a thermally curable polymer composition comprising a hydroxyl-containing polymer and a polyfunctional epoxide as a crosslinking agent. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography. In addition, the present invention also relates to a photolithographic coated substrate comprising: a substrate, the thermally cured undercoat composition on the substrate, and a radiation-sensitive resist topcoat on the thermally cured undercoat composition. Furthermore, the present invention further relates to a process for using the photolithographic coated substrate for the production of relief structures.

Hydroxy-epoxide thermally cured undercoat for 193 NM lithography

The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.

Production of acetal derivatized hydroxyl aromatic polymers and their use in radiation sensitive formulations

Hydroxy-amino thermally cured undercoat for 193 NM lithography

Production of acetal derivatized hydroxyl aromatic polymers and their

A terpolymer with chemically amplified (acid labile) moieties and organosilicon moieties suitable for use as the binder resin for a photoimageable resist photoresist composition suitable for use in 193 nm photolithographic processes. The terpolymers have the following structural units: ##STR1## where R is a methyl or hydroxyethyl group, R.sup.1 is a hydrogen atom, a methyl group or a --CH.sub.2 COOCH.sub.3 group and R.sup.2 and R.sup.3 are each independently a hydrogen atom or a methyl group.

Radiation sensitive terpolymer, photoresist compositions thereof and 193

A heat resistant positive-working photosensitive composition that has a polybenzoxazole precursor bearing acid labile functional groups, a photoacid generator, a photosensitizer, and a solvent. The polybenzoxazole precursor bearing acid labile functional groups, has the structure: ##STR1## wherein k.sub.1 is an integer of 1 or 2, k.sub.2 is an interger of 0 or 1, and the sum of k.sub.1 and k.sub.2 is 2; Ar.sub.1 is a tetravalent aromatic, aliphatic, or heterocyclic group, or mixtures thereof; Ar.sub.2 is a divalent aromatic, aliphatic, or heterocyclic group or siloxane group; D is a monovalent acid labile group; and n is an integer from 20 to 200. A portion of Ar.sub.1 can be a divalent aromatic, aliphatic, or heterocyclic diamine moiety such that the fraction of diamine compound is 0-60 mole percent and the sum of diamine and diamino dihydroxy compound is 100%. Preparation of chemical amplification based positive-working, aqueous base developable photosensitive polybenzoxazole (PBO) precursors, the formulation of the resin composition, and the process for preparing heat-resistant relief structures from this resin composition. The positive photosensitive resin compositions are suitable especially for applications in microelectronics.

Photosensitive polybenzoxazole precursor compositions

Growing community of inventors

Seekonk, MA, United States of America

Andrew J Blakeney