Kionix, Inc.

Andrew Hocking

Martin Heller

Sangtae Park

Scott A Miller

Kristin J Lynch

Wenting Gu

Scott G Adams

Charles W Blackmer

Jonah deWall

Nicole Kerness

Randy Phillips

Mizuho Okada

Ashish A Shah

A micro-electromechanical system (MEMS) device comprises a fixed portion and a proofmass suspended by at least one composite beam. The composite beam is cantilevered relative to the fixed portion and extends between a first end that is integrally formed with the fixed portion and a second distal end. The composite beam comprises an insulator having a top surface and at least two side surfaces; a conductor extending away from the fixed portion and surrounding at least a portion of the insulator; and a second conductor positioned adjacent to the top surface of the conductor and extending parallel with the insulator away from the fixed portion. The second conductor is separated from the first conductor to provide a low parasitic conductance of the composite beam.

Composite spring for robust piezoelectric sensing

A micro-electromechanical system (MEMS) device includes a substrate and a beam suspended relative to a surface of the substrate. The substrate includes a buried insulator layer and a cavity. The beam includes a first portion and a second portion that are separated by an isolation joint. The cavity separates the surface of the substrate from the beam.

Micro-electromechanical system devices and methods

A MEMS includes, in part, a parallel plate capacitor, a proofmass adapted to be displaced by a first distance from a rest state in response to a first voltage applied to the capacitor, and a piezoelectric material adapted to generate a second voltage in response to an external force applied to the MEMS. The second voltage causes the MEMS to transition from a standby mode to an active mode of operation. The proofmass is displaced by a second distance in response to the external force thereby causing the piezoelectric material to generate the second voltage. A spring couples the proofmass to the piezoelectric material, and a transistor turns on in response to the second voltage thereby causing the MEMS to transition to the active mode of operation. The proofmass returns to the rest state when the MEMS is in the active mode of operation.

Near-zero power wakeup electro-mechanical system

A MEMS device includes, in part, first and second conductive semiconductor substrates, an insulating material disposed between the semiconductor substrates, a cavity formed in the second semiconductor substrate, and at least first and second drive masses each of which includes a multitude of beams etched from the first semiconductor substrate and is adapted to move in the cavity in response to an applied force. At least a first portion of the first substrate is adapted to move in response to the applied force and causes the at least first and second drive mass to be in electrical communication with the first substrate. The device may further include, in part, a coupling spring disposed between and in electrical communication with the first and second drive masses. The coupling spring is adapted to provide electrical communication between a second portion of the first substrate and the first and second drive masses.

Electrical connection to a micro electro-mechanical system

A method of fabricating a semiconductor device, includes, in part, growing a first layer of oxide on a surface of a first semiconductor substrate, forming a layer of insulating material on the oxide layer, patterning and etching the insulating material and the first oxide layer to form a multitude of oxide-insulator structures and further to expose the surface of the semiconductor substrate, growing a second layer of oxide in the exposed surface of the semiconductor substrate, and removing the second layer of oxide thereby to form a cavity in which a MEMS device is formed. The process of growing oxide in the exposed surface of the cavity and removing this oxide may be repeated until the cavity depth reaches a predefined value. Optionally, a multitude of bump stops is formed in the cavity.

Method for manufacturing a micro electro-mechanical system

In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.

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Ithaca, NY, United States of America

Andrew Hocking