3m Innovative Properties Company

Andrew H Behr

Terry Lee Smith

William J Schultz

Wendy L Thompson

Brian D Goers

Daniel B Pendergrass, Jr

Eumi Pyun

Gary M Palmgren

Victoria A Russell

Stephen J Znameroski

Vincent J Laraia

The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, and at least one of a radio frequency identification (RFID) tag, a RFID tag reader, or a sensor for providing CMP information to a transmitter positioned near the substrate, the transmitter positioned near the substrate and adapted to wirelessly receive CMP information and wirelessly transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner for wirelessly communicating CMP information to a remote receiver, a CMP process monitoring system for wirelessly communicating CMP information to a remote receiver, and a method for conditioning a CMP pad using a CMP process monitoring system for wireless communicating CMP information to a remote receiver.

Abrasive articles, CMP monitoring system and method

A method of bonding a first article to a second article is provided. The method involves the use of a flowable, adhesive composition that contains non-aggregated, surface-modified silica nanoparticles dispersed in an epoxy resin.

Bonding method with flowable adhesive composition

Growing community of inventors

Littleton, CO, United States of America

Andrew H Behr